发明授权
US08120040B2 Substrate for mounting IC chip, manufacturing method of substrate for mounting IC chip, device for optical communication, and manufacturing method of device for optical communication
有权
用于安装IC芯片的基板，用于安装IC芯片的基板的制造方法，光通信装置以及用于光通信的装置的制造方法
- 专利标题： Substrate for mounting IC chip, manufacturing method of substrate for mounting IC chip, device for optical communication, and manufacturing method of device for optical communication
- 专利标题（中）： 用于安装IC芯片的基板，用于安装IC芯片的基板的制造方法，光通信装置以及用于光通信的装置的制造方法
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申请号： US12785786申请日： 2010-05-24
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公开(公告)号： US08120040B2公开(公告)日： 2012-02-21
- 发明人: Motoo Asai , Hiroaki Kodama , Toyoaki Tanaka
- 申请人： Motoo Asai , Hiroaki Kodama , Toyoaki Tanaka
- 申请人地址： JP Ogaki-shi
- 专利权人： Ibiden Co., Ltd.
- 当前专利权人： Ibiden Co., Ltd.
- 当前专利权人地址： JP Ogaki-shi
- 代理机构： Oblon, Spivak, McClelland, Maier & Neustadt, L.L.P.
- 优先权： JP2002-099305 20020401; JP2002-099306 20020401; JP2002-099307 20020401
- 主分类号： H01L29/04
- IPC分类号： H01L29/04
摘要：
A device for optical communication including a substrate for mounting an IC chip, and a multilayered printed circuit board. An optical path for transmitting optical signal which penetrates the substrate for mounting an IC chip is formed in the substrate for mounting an IC chip.
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