公开(公告)号：US20100232744A1

公开(公告)日：2010-09-16

申请号：US12785786

申请日：2010-05-24

申请人： Motoo ASAI ,  Hiroaki Kodama ,  Toyoaki Tanaka

发明人： Motoo ASAI ,  Hiroaki Kodama ,  Toyoaki Tanaka

IPC分类号： G02B6/12

CPC分类号： G02B6/43 ,  H01L24/73 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01045 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/01058 ,  H01L2924/01061 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01087 ,  H01L2924/01088 ,  H01L2924/01322 ,  H01L2924/10329 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/12043 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/15787 ,  H01L2924/15788 ,  H01L2924/19041 ,  H05K1/0274 ,  H05K3/28 ,  H05K3/4602 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/05599

摘要： A device for optical communication including a substrate for mounting an IC chip, and a multilayered printed circuit board. An optical path for transmitting optical signal which penetrates the substrate for mounting an IC chip is formed in the substrate for mounting an IC chip.

摘要翻译： 一种用于光通信的装置，包括用于安装IC芯片的基板和多层印刷电路板。 在用于安装IC芯片的基板中形成有用于透射用于安装IC芯片的基板的用于透射光信号的光路。

公开(公告)号：US08120040B2

公开(公告)日：2012-02-21

申请号：US12785786

申请日：2010-05-24

申请人： Motoo Asai ,  Hiroaki Kodama ,  Toyoaki Tanaka

发明人： Motoo Asai ,  Hiroaki Kodama ,  Toyoaki Tanaka

IPC分类号： H01L29/04

CPC分类号： G02B6/43 ,  H01L24/73 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01045 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/01058 ,  H01L2924/01061 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01087 ,  H01L2924/01088 ,  H01L2924/01322 ,  H01L2924/10329 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/12043 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/15787 ,  H01L2924/15788 ,  H01L2924/19041 ,  H05K1/0274 ,  H05K3/28 ,  H05K3/4602 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/05599

摘要： A device for optical communication including a substrate for mounting an IC chip, and a multilayered printed circuit board. An optical path for transmitting optical signal which penetrates the substrate for mounting an IC chip is formed in the substrate for mounting an IC chip.

摘要翻译： 一种用于光通信的装置，包括用于安装IC芯片的基板和多层印刷电路板。 在用于安装IC芯片的基板中形成有用于透射用于安装IC芯片的基板的用于透射光信号的光路。

公开(公告)号：US20060012967A1

公开(公告)日：2006-01-19

申请号：US10509899

申请日：2003-03-28

申请人： Motoo Asai ,  Hiroaki Kodama ,  Toyoaki Tanaka

发明人： Motoo Asai ,  Hiroaki Kodama ,  Toyoaki Tanaka

IPC分类号： H05K1/18

CPC分类号： G02B6/43 ,  H01L24/73 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01045 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/01058 ,  H01L2924/01061 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01087 ,  H01L2924/01088 ,  H01L2924/01322 ,  H01L2924/10329 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/12043 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/15787 ,  H01L2924/15788 ,  H01L2924/19041 ,  H05K1/0274 ,  H05K3/28 ,  H05K3/4602 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/05599

摘要： An object of the present invention is to provide a substrate for mounting an IC chip which is a component for optical communication having an IC chip and an optical component integrally provided thereon, which can ensure a short distance between the IC chip and the optical component, which is excellent in electric signal transmission reliability and which can transmit optical signal through an optical path for transmitting optical signal. The substrate for mounting an IC chip of the present invention is a substrate for mounting an IC chip comprising: a substrate and, as serially built up on both faces thereof, a conductor circuit and an interlaminar insulating layer in an alternate fashion and in repetition; a solder resist layer formed as an outermost layer; and an optical element mounted thereto, wherein an optical path for transmitting optical signal, which penetrates the substrate for mounting an IC chip, is disposed.

摘要翻译： 本发明的目的是提供一种用于安装IC芯片的基板，IC芯片是用于光通信的部件，其具有一体地设置在其上的IC芯片和光学部件，其可以确保IC芯片和光学部件之间的短距离， 其电信号传输可靠性优异，可以通过用于发送光信号的光路传输光信号。 用于安装本发明的IC芯片的基板是用于安装IC芯片的基板，其包括：基板，并且在其两个表面上串联构成导体电路和层间绝缘层，并且重复; 形成为最外层的阻焊层; 以及安装在其上的光学元件，其中设置用于透射光信号的光路，其穿透用于安装IC芯片的基板。

公开(公告)号：US08076782B2

公开(公告)日：2011-12-13

申请号：US10509899

申请日：2003-03-28

申请人： Motoo Asai ,  Hiroaki Kodama ,  Toyoaki Tanaka

发明人： Motoo Asai ,  Hiroaki Kodama ,  Toyoaki Tanaka

IPC分类号： H01L29/40

CPC分类号： G02B6/43 ,  H01L24/73 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01045 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/01058 ,  H01L2924/01061 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01087 ,  H01L2924/01088 ,  H01L2924/01322 ,  H01L2924/10329 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/12043 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/15787 ,  H01L2924/15788 ,  H01L2924/19041 ,  H05K1/0274 ,  H05K3/28 ,  H05K3/4602 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/05599

摘要： An object of the present invention is to provide a substrate for mounting an IC chip which is a component for optical communication having an IC chip and an optical component integrally provided thereon, which can ensure a short distance between the IC chip and the optical component, which is excellent in electric signal transmission reliability and which can transmit optical signal through an optical path for transmitting optical signal.The substrate for mounting an IC chip of the present invention is a substrate for mounting an IC chip comprising: a substrate and, as serially built up on both faces thereof, a conductor circuit and an interlaminar insulating layer in an alternate fashion and in repetition; a solder resist layer formed as an outermost layer; and an optical element mounted thereto, wherein an optical path for transmitting optical signal, which penetrates the substrate for mounting an IC chip, is disposed.

摘要翻译： 本发明的目的是提供一种用于安装IC芯片的基板，IC芯片是用于光通信的部件，其具有一体地设置在其上的IC芯片和光学部件，其可以确保IC芯片和光学部件之间的短距离， 其电信号传输可靠性优异，可以通过用于发送光信号的光路传输光信号。 用于安装本发明的IC芯片的基板是用于安装IC芯片的基板，其包括：基板，并且在其两个表面上串联构成导体电路和层间绝缘层，并且重复; 形成为最外层的阻焊层; 以及安装在其上的光学元件，其中设置用于透射光信号的光路，其穿透用于安装IC芯片的基板。

公开(公告)号：US07783141B2

公开(公告)日：2010-08-24

申请号：US11696434

申请日：2007-04-04

申请人： Hiroaki Kodama ,  Toyoaki Tanaka ,  Kazuhito Yamada

发明人： Hiroaki Kodama ,  Toyoaki Tanaka ,  Kazuhito Yamada

IPC分类号： G02B6/42

CPC分类号： G02B6/4204 ,  G02B6/4212 ,  G02B6/4214 ,  G02B6/4246 ,  G02B6/43 ,  H05K1/0274 ,  H05K3/4602

摘要： The substrate for mounting an IC chip according to the present invention is a substrate for mounting an IC chip, where conductor circuits and insulating layers are formed and layered, an optical element is mounted, an optical path for transmitting an optical signal is formed, wherein an optical element sealing layer is formed so as to make contact with the periphery of the above described optical element.

摘要翻译： 根据本发明的用于安装IC芯片的基板是用于安装IC芯片的基板，其中形成导体电路和绝缘层并分层，安装光学元件，形成用于传输光信号的光路，其中 光学元件密封层形成为与上述光学元件的周边接触。

公开(公告)号：US20080247703A1

公开(公告)日：2008-10-09

申请号：US11696434

申请日：2007-04-04

申请人： Hiroaki KODAMA ,  Toyoaki Tanaka ,  Kazuhito Yamada

发明人： Hiroaki KODAMA ,  Toyoaki Tanaka ,  Kazuhito Yamada

IPC分类号： G02B6/12

CPC分类号： G02B6/4204 ,  G02B6/4212 ,  G02B6/4214 ,  G02B6/4246 ,  G02B6/43 ,  H05K1/0274 ,  H05K3/4602

摘要： The substrate for mounting an IC chip according to the present invention is a substrate for mounting an IC chip, where conductor circuits and insulating layers are formed and layered, an optical element is mounted, an optical path for transmitting an optical signal is formed, wherein an optical element sealing layer is formed so as to make contact with the periphery of the above described optical element.

摘要翻译： 根据本发明的用于安装IC芯片的基板是用于安装IC芯片的基板，其中形成导体电路和绝缘层并分层，安装光学元件，形成用于传输光信号的光路，其中 光学元件密封层形成为与上述光学元件的周边接触。

公开(公告)号：US06184613B2

公开(公告)日：2001-02-06

申请号：US09152787

申请日：1998-09-14

申请人： Satoshi Inoue ,  Toyoaki Tanaka

发明人： Satoshi Inoue ,  Toyoaki Tanaka

IPC分类号： H01J120

CPC分类号： C25D7/12 ,  C25D17/001 ,  C25D17/10

摘要： An electrode assembly including a first cathode member provided with a hole enclosed by a frame portion. The frame portion surrounding the hole has a contact surface that comes into contact with an object to be plated at one of its surfaces, and an insulating member is provided with holes and enclosed by a frame portion, with one surface of the frame portion placed on top of another surface of the frame portion of the first cathode member. A second cathode member also provided with a hole enclosed by a frame portion, with one surface of the frame portion placed on top of one surface of the other frame portion of the insulating member. The smallest bore diameter at the hole of the second cathode member is larger than the smallest bore diameter at the holes and of the insulating member.

摘要翻译： 一种电极组件，包括设置有由框架部分包围的孔的第一阴极部件。 围绕孔的框架部分具有接触表面，该接触表面与其表面中的一个处被镀覆的物体接触，并且绝缘构件设置有孔并被框架部分包围，框架部分的一个表面放置在 第一阴极部件的框架部分的另一个表面的顶部。 第二阴极部件还设置有由框架部分包围的孔，框架部分的一个表面放置在绝缘构件的另一框架部分的一个表面的顶部上。 在第二阴极部件的孔处的最小孔径大于孔和绝缘部件处的最小孔径。

公开(公告)号：US4931005A

公开(公告)日：1990-06-05

申请号：US304089

申请日：1989-01-31

申请人： Toyoaki Tanaka ,  Katuzi Ohira ,  Akira Nakamura ,  Ryosuke Kamei ,  Akihiro Hashimoto

发明人： Toyoaki Tanaka ,  Katuzi Ohira ,  Akira Nakamura ,  Ryosuke Kamei ,  Akihiro Hashimoto

IPC分类号： A61F13/00 ,  A61F13/15 ,  A61F13/53 ,  B32B7/00 ,  B32B27/12 ,  D01G13/00 ,  D04H1/54

CPC分类号： D04H1/54 ,  A61F13/15642 ,  D21H17/71 ,  D21H23/10 ,  D21H5/2628 ,  A61F2013/00119 ,  A61F2013/15048 ,  A61F2013/15821 ,  A61F2013/530481 ,  A61F2013/53445 ,  Y10S428/913 ,  Y10T428/25 ,  Y10T428/253 ,  Y10T428/2982 ,  Y10T442/676 ,  Y10T442/678

摘要： An apparatus for the preparation of an elastic absorbent composed of a mixed web. Elements of the apparatus can include two supply hoppers for separately supplying pulverized pulp and staple fibers of a synthetic fiber split yarn at a constant mixing ratio with each hopper having a pair of confronting moving belts, two guide mechanisms located below the hoppers, a pair of nip rollers located below the guide mechanisms, a garnet roll located below the pair of nip rollers, a vacuum device located below the garnet roll, and a mesh belt located between the vacuum device and the garnet roll. Each guide mechanism in the apparatus may include at least two gear guides arranged in series. The apparatus operates by feeding the pulverized pulp and the staple fibers of the split yarn from the hoppers to the nip rolls via the guide mechanisms. The nip rolls compress the material, which is then disintegrated and mixed by the garnet roll. The mixture is pulled onto the mesh belt by the vacuum device.

公开(公告)号：US07881423B2

公开(公告)日：2011-02-01

申请号：US11467811

申请日：2006-08-28

申请人： Masaharu Tsuyuki ,  Toyoaki Tanaka

发明人： Masaharu Tsuyuki ,  Toyoaki Tanaka

IPC分类号： A61B6/00

CPC分类号： A61B6/032 ,  A61B6/5235

摘要： An X-ray CT apparatus is adapted for switchover between a CT mode to obtain a tomographic image of a subject and a transmission mode to obtain a transmission image of the subject, depending upon projection data acquired in an imager system thereof. The apparatus includes an image-data storage device that stores image data of the subject in a three-dimensional region, a three-dimensional image processor that performs a three-dimensional image processing on the image data and generates three-dimensional image data, for display, corresponding to a line-of-sight direction inputted from an input device, and a transmission-image generator that generates the transmission image as to the image-taking direction, from data acquired in the imager system aligned by the CPU.

摘要翻译： X射线CT装置适于在CT模式之间进行切换，以获得被摄体的断层图像和透射模式，以根据在其成像系统中获取的投影数据来获得被摄体的透射图像。 该装置包括存储三维区域中的被摄体的图像数据的图像数据存储装置，对该图像数据进行三维图像处理并生成三维图像数据的三维图像处理装置，生成三维图像数据， 显示，对应于从输入装置输入的视线方向，以及发送图像生成器，从通过CPU对准的成像器系统中获取的数据，生成关于拍摄方向的发送图像。

公开(公告)号：US5143786A

公开(公告)日：1992-09-01

申请号：US708692

申请日：1991-05-31

申请人： Toyoaki Tanaka ,  Akira Nakamura ,  Yoshisuke Kamei ,  Akihiro Hashimoto

发明人： Toyoaki Tanaka ,  Akira Nakamura ,  Yoshisuke Kamei ,  Akihiro Hashimoto

IPC分类号： A61L15/42 ,  D01D5/42 ,  D01F8/04 ,  D04H1/54

CPC分类号： D04H1/54 ,  A61L15/42 ,  D01D5/42 ,  D01F8/04 ,  Y10S57/907 ,  Y10T428/249921 ,  Y10T428/29 ,  Y10T428/2904 ,  Y10T428/2909 ,  Y10T428/2913 ,  Y10T428/2922 ,  Y10T428/2924 ,  Y10T428/2929 ,  Y10T428/2931 ,  Y10T442/637

摘要： The present invention uses, as a base material, a multi-layer film comprising more than two layers and formed from thermoplastic resins different in melting point from one another. A sectional construction of the multi-layer film or a tape obtained from the multi-layer film is applied to a sectional construction of a fibre without modification, the multi-layer film or tape being formed into the fibre. The invention provides a composite fibre which is much more excellent as compared to a conventional heat adhesive composite fibre by melt spinning, a water-absorbing material using the composite fibre as a base material and a method for the production of the same by the stated simple means.