发明授权
US08120068B2 Three-dimensional memory structures having shared pillar memory cells
有权
具有共享支柱存储单元的三维存储器结构
- 专利标题: Three-dimensional memory structures having shared pillar memory cells
- 专利标题(中): 具有共享支柱存储单元的三维存储器结构
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申请号: US12344022申请日: 2008-12-24
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公开(公告)号: US08120068B2公开(公告)日: 2012-02-21
- 发明人: Roy E Scheuerlein , Eliyahou Harari
- 申请人: Roy E Scheuerlein , Eliyahou Harari
- 申请人地址: US CA Milpitas
- 专利权人: SanDisk 3D LLC
- 当前专利权人: SanDisk 3D LLC
- 当前专利权人地址: US CA Milpitas
- 代理机构: Vierra Magen Marcus & DeNiro LLP
- 主分类号: H01L27/02
- IPC分类号: H01L27/02
摘要:
A three-dimensional non-volatile memory system is disclosed including a memory array utilizing shared pillar structures for memory cell formation. A shared pillar structure includes two non-volatile storage elements. A first end surface of each pillar contacts one array line from a first set of array lines and a second end surface of each pillar contacts two array lines from a second set of array lines that is vertically separated from the first set of array lines. Each pillar includes a first subset of layers that are divided into portions for the individual storage elements in the pillar. Each pillar includes a second subset of layers that is shared between both non-volatile storage elements formed in the pillar. The individual storage elements each include a steering element and a state change element.
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