发明授权
- 专利标题： Integrated circuit comprising conductive lines and contact structures and method of manufacturing an integrated circuit
- 专利标题（中）： 包括导线和接触结构的集成电路以及制造集成电路的方法
-
申请号： US12354140申请日： 2009-01-15
-
公开(公告)号： US08120182B2公开(公告)日： 2012-02-21
- 发明人: Andreas Thies , Sirko Kramp , Helmut Schneider , Rainer Florian Schnabel
- 申请人： Andreas Thies , Sirko Kramp , Helmut Schneider , Rainer Florian Schnabel
- 申请人地址： DE Munich
- 专利权人： Qimonda AG
- 当前专利权人： Qimonda AG
- 当前专利权人地址： DE Munich
- 代理商 John S. Economou
- 优先权： DE102008004927 20080118
- 主分类号： H01L23/48
- IPC分类号： H01L23/48 ; H01L23/52 ; H01L29/40
摘要：
An integrated circuit comprises a first conductive lines and second lines as well as contact structures being in contact with the first and second conductive lines. The first conductive lines are arranged in a first metallization level, and second conductive lines are arranged in a second metallization level arranged above the first metallization level. The second conductive lines are arranged above the contact structures, and a pitch of neighboring contact structures is equal to a pitch of neighboring second conductive lines. The distance between neighboring contact structures is smaller than 100 nm.
公开/授权文献
信息查询
IPC分类:
