Invention Grant
- Patent Title: Molded semiconductor device, apparatus for producing the same, and method for manufacturing the same
- Patent Title (中): 模制半导体器件及其制造方法及其制造方法
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Application No.: US11806923Application Date: 2007-06-05
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Publication No.: US08125079B2Publication Date: 2012-02-28
- Inventor: Tetsuo Ito , Takayuki Yoshida , Toshiyuki Fukuda , Takao Ochi
- Applicant: Tetsuo Ito , Takayuki Yoshida , Toshiyuki Fukuda , Takao Ochi
- Applicant Address: JP Osaka
- Assignee: Panasonic Corporation
- Current Assignee: Panasonic Corporation
- Current Assignee Address: JP Osaka
- Agency: Steptoe & Johnson LLP
- Priority: JP2006-169477 20060620
- Main IPC: H01L23/34
- IPC: H01L23/34 ; H01L21/00
Abstract:
A resin molding mold 20 with a cavity 21 has a resin injection port 29a from which a molding resin 25 is injected toward the cavity 21, and an air release port 30a from which air from the cavity 21 is released during resin injection. Not only the resin injection port 29a but also the air release port 30a is formed in a top surface portion 21a of the cavity 21. Thus, even if a resin burr remains in the resin injection port 29a or the air release port 30a, it can be prevented from adhering to an external terminal 4A provided on a front surface portion 2a of the substrate 2.
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