发明授权
- 专利标题： Multilayer printed wiring board and electronic device using the same
- 专利标题（中）： 多层印刷线路板及使用其的电子设备
-
申请号： US12405813申请日： 2009-03-17
-
公开(公告)号： US08125794B2公开(公告)日： 2012-02-28
- 发明人: Kenji Kouya
- 申请人： Kenji Kouya
- 申请人地址： JP Kawasaki-Shi
- 专利权人： NEC Infrontia Corporation
- 当前专利权人： NEC Infrontia Corporation
- 当前专利权人地址： JP Kawasaki-Shi
- 代理机构： Sughrue Mion, PLLC
- 优先权： JP2008-070542 20080319
- 主分类号： H05K1/11
- IPC分类号： H05K1/11 ; H05K1/14
摘要：
The invention provides a multilayer printed wiring board including: a power supply wiring layer and a ground wiring layer provided so as to oppose each other via an insulation layer; mounted integrated circuits; and decoupling capacitors mounted in proximity to the integrated circuits and connected between the power supply wiring layer and the ground wiring layer to absorb noise from the integrated circuits. The power supply wiring layer includes through holes for connecting the decoupling capacitors to the power supply wiring layer and has a polygonal form formed by straight lines which link some of the through holes.
公开/授权文献
信息查询
