公开(公告)号：US20090237902A1

公开(公告)日：2009-09-24

申请号：US12405813

申请日：2009-03-17

申请人： Kenji KOUYA

发明人： Kenji KOUYA

IPC分类号： H05K7/02 ,  H05K7/00

CPC分类号： H05K1/0231 ,  H05K1/0224 ,  H05K3/429 ,  H05K2201/093 ,  H05K2201/09309 ,  H05K2201/0949 ,  H05K2201/10522 ,  H05K2201/10689

摘要： The invention provides a multilayer printed wiring board including: a power supply wiring layer and a ground wiring layer provided so as to oppose each other via an insulation layer; mounted integrated circuits; and decoupling capacitors mounted in proximity to the integrated circuits and connected between the power supply wiring layer and the ground wiring layer to absorb noise from the integrated circuits. The power supply wiring layer includes through holes for connecting the decoupling capacitors to the power supply wiring layer and has a polygonal form formed by straight lines which link some of the through holes.

摘要翻译： 本发明提供了一种多层印刷线路板，包括：电源布线层和通过绝缘层彼此相对设置的接地布线层; 安装集成电路; 以及安装在集成电路附近并连接在电源布线层和接地布线层之间的去耦电容器，以吸收集成电路的噪声。 电源布线层包括用于将去耦电容器连接到电源布线层的通孔，并且具有通过连接一些通孔的直线形成的多边形形状。

公开(公告)号：US08125794B2

公开(公告)日：2012-02-28

申请号：US12405813

申请日：2009-03-17

申请人： Kenji Kouya

发明人： Kenji Kouya

IPC分类号： H05K1/11 ,  H05K1/14

CPC分类号： H05K1/0231 ,  H05K1/0224 ,  H05K3/429 ,  H05K2201/093 ,  H05K2201/09309 ,  H05K2201/0949 ,  H05K2201/10522 ,  H05K2201/10689

摘要： The invention provides a multilayer printed wiring board including: a power supply wiring layer and a ground wiring layer provided so as to oppose each other via an insulation layer; mounted integrated circuits; and decoupling capacitors mounted in proximity to the integrated circuits and connected between the power supply wiring layer and the ground wiring layer to absorb noise from the integrated circuits. The power supply wiring layer includes through holes for connecting the decoupling capacitors to the power supply wiring layer and has a polygonal form formed by straight lines which link some of the through holes.

摘要翻译： 本发明提供了一种多层印刷线路板，包括：电源布线层和通过绝缘层彼此相对设置的接地布线层; 安装集成电路; 以及安装在集成电路附近并连接在电源布线层和接地布线层之间的去耦电容器，以吸收集成电路的噪声。 电源布线层包括用于将去耦电容器连接到电源布线层的通孔，并且具有通过连接一些通孔的直线形成的多边形形状。