发明授权
- 专利标题: Solid-state imaging device and method for manufacturing the same
- 专利标题(中): 固态成像装置及其制造方法
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申请号: US12545924申请日: 2009-08-24
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公开(公告)号: US08129213B2公开(公告)日: 2012-03-06
- 发明人: Harumi Ikeda , Masashi Nakazawa
- 申请人: Harumi Ikeda , Masashi Nakazawa
- 申请人地址: JP Tokyo
- 专利权人: Sony Corporation
- 当前专利权人: Sony Corporation
- 当前专利权人地址: JP Tokyo
- 代理机构: SNR Denton US LLP
- 优先权: JP2008-217255 20080826
- 主分类号: H01L21/00
- IPC分类号: H01L21/00
摘要:
Disclosed herein is a solid-state imaging device including: a semiconductor layer; a charge accumulation region configured to be formed inside the semiconductor layer and serve as part of a photodiode; and a reflective surface configured to be disposed inside or under the charge accumulation region and be so formed as to reflect light that has passed through the charge accumulation region and direct the light toward a center part of the charge accumulation region.
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