发明授权
US08129224B2 Stud bumps as local heat sinks during transient power operations
有权
瞬态功率运行期间，当局部散热片时，螺柱凸起
- 专利标题： Stud bumps as local heat sinks during transient power operations
- 专利标题（中）： 瞬态功率运行期间，当局部散热片时，螺柱凸起
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申请号： US12906240申请日： 2010-10-18
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公开(公告)号： US08129224B2公开(公告)日： 2012-03-06
- 发明人: Siva P Gurrum , Kapil H Sahasrabudhe , Vikas Gupta
- 申请人： Siva P Gurrum , Kapil H Sahasrabudhe , Vikas Gupta
- 申请人地址： US TX Dallas
- 专利权人： Texas Instruments Incorporated
- 当前专利权人： Texas Instruments Incorporated
- 当前专利权人地址： US TX Dallas
- 代理商 Steven A. Shaw; Wade J. Brady; Frederick J. Telecky, Jr.
- 主分类号： H01L21/50
- IPC分类号： H01L21/50 ; H01L21/48 ; H01L21/44
摘要：
A thermal management configuration for a flip chip semiconductor device is disclosed. The device includes a high power silicon based die having a metal bonding surface. A plurality of interconnects are formed on the metal surface and connected to a substrate. A plurality of thermal management stud bumps are formed on the metal bonding surface, the thermal management stud bumps positioned distinct from the interconnects and local to die hot spots, exposed ends of the thermal management stud bumps spaced from the substrate.