Invention Grant
US08129745B2 Method of manufacturing an instant pulse filter using anodic oxidation and instant pulse filter manufactured by said method
失效
使用所述方法制造的使用阳极氧化的瞬时脉冲滤波器和即时脉冲滤波器的方法
- Patent Title: Method of manufacturing an instant pulse filter using anodic oxidation and instant pulse filter manufactured by said method
- Patent Title (中): 使用所述方法制造的使用阳极氧化的瞬时脉冲滤波器和即时脉冲滤波器的方法
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Application No.: US13057493Application Date: 2009-04-03
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Publication No.: US08129745B2Publication Date: 2012-03-06
- Inventor: Hak Beom Moon , Jin Hyung Cho , Suc Hyun Bang , Cheol Hwan Kim , Yoon Hyung Jang
- Applicant: Hak Beom Moon , Jin Hyung Cho , Suc Hyun Bang , Cheol Hwan Kim , Yoon Hyung Jang
- Applicant Address: KR Busan
- Assignee: Nextron Corporation
- Current Assignee: Nextron Corporation
- Current Assignee Address: KR Busan
- Agency: Finnegan, Henderson, Farabow, Garrett and Dunner, LLP
- Priority: KR10-2008-0076812 20080806
- International Application: PCT/KR2009/001725 WO 20090403
- International Announcement: WO2010/016648 WO 20100211
- Main IPC: H01L21/00
- IPC: H01L21/00

Abstract:
The instant pulse filter according to the present invention, which may cause a malfunction or a short life span of a semiconductor device, is made using an aluminum anodic oxidation, comprising—a first step for forming an aluminum thin film layer on an upper side of an insulator substrate; a second step for forming an aluminum oxide thin film layer having a pore by oxidizing the aluminum thin film layer by means of an anodic oxidation; a third step for depositing a metallic material on an upper side of the aluminum thin film layer for filling the pore; a fourth step for forming a nano rod in the interior of the aluminum oxide thin film layer by eliminating the metallic material deposited except in the pore; a fifth step for forming an internal electrode on an upper side of the aluminum oxide thin film layer having the nano rod; a sixth step for forming a protective film layer on an upper side of the same in order to protect the aluminum oxide thin film layer and the internal electrode from the external environment; and a seventh step for forming an external electrode on both sides of the substrate in which the protective film layer is formed.
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