发明授权
US08129783B2 Lateral power MOSFET with high breakdown voltage and low on-resistance
有权
具有高击穿电压和低导通电阻的侧向功率MOSFET
- 专利标题: Lateral power MOSFET with high breakdown voltage and low on-resistance
- 专利标题(中): 具有高击穿电压和低导通电阻的侧向功率MOSFET
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申请号: US12329285申请日: 2008-12-05
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公开(公告)号: US08129783B2公开(公告)日: 2012-03-06
- 发明人: Tsung-Yi Huang , Puo-Yu Chiang , Ruey-Hsin Liu , Shun-Liang Hsu
- 申请人: Tsung-Yi Huang , Puo-Yu Chiang , Ruey-Hsin Liu , Shun-Liang Hsu
- 申请人地址: TW Hsin-Chu
- 专利权人: Taiwan Semiconductor Manufacturing Co., Ltd.
- 当前专利权人: Taiwan Semiconductor Manufacturing Co., Ltd.
- 当前专利权人地址: TW Hsin-Chu
- 代理机构: Slater & Matsil, L.L.P.
- 主分类号: H01L29/78
- IPC分类号: H01L29/78
摘要:
A semiconductor device with high breakdown voltage and low on-resistance is provided. An embodiment comprises a substrate having a buried layer in a portion of the top region of the substrate in order to extend the drift region. A layer is formed over the buried layer and the substrate, and high-voltage N-well and P-well regions are formed adjacent to each other. Field dielectrics are located over portions of the high-voltage N-wells and P-wells, and a gate dielectric and a gate conductor are formed over the channel region between the high-voltage P-well and the high-voltage N-well. Source and drain regions for the transistor are located in the high-voltage P-well and high-voltage N-well. Optionally, a P field ring is formed in the N-well region under the field dielectric. In another embodiment, a lateral power superjunction MOSFET with partition regions located in the high-voltage N-well is manufactured with an extended drift region.
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