发明授权
US08129846B2 Board adapted to mount an electronic device, semiconductor module and manufacturing method therefor, and portable device 有权
适于安装电子设备,半导体模块及其制造方法的板和便携式设备

Board adapted to mount an electronic device, semiconductor module and manufacturing method therefor, and portable device
摘要:
A board adapted to mount an electronic device includes an insulating resin layer, a wiring layer of a predetermined pattern provided on one surface of the insulating resin layer, a bump electrode provided on an insulating-resin-layer-side surface of the wiring layer, and a covering, formed of a metal layer, which covers a top surface of the bump electrode and a region, at a side surface of the bump electrode, continuous with the top surface excluding a region in contact with the wiring layer.
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