发明授权
- 专利标题: Board adapted to mount an electronic device, semiconductor module and manufacturing method therefor, and portable device
- 专利标题(中): 适于安装电子设备,半导体模块及其制造方法的板和便携式设备
-
申请号: US12266907申请日: 2008-11-07
-
公开(公告)号: US08129846B2公开(公告)日: 2012-03-06
- 发明人: Tetsuya Yamamoto , Yoshio Okayama , Yasuyuki Yanase
- 申请人: Tetsuya Yamamoto , Yoshio Okayama , Yasuyuki Yanase
- 申请人地址: JP Osaka
- 专利权人: Sanyo Electric Co., Ltd.
- 当前专利权人: Sanyo Electric Co., Ltd.
- 当前专利权人地址: JP Osaka
- 代理机构: McDermott Will & Emery LLP
- 优先权: JP2007-291342 20071108; JP2008-273591 20081023
- 主分类号: H01L23/48
- IPC分类号: H01L23/48 ; H01L23/52 ; H01L29/40
摘要:
A board adapted to mount an electronic device includes an insulating resin layer, a wiring layer of a predetermined pattern provided on one surface of the insulating resin layer, a bump electrode provided on an insulating-resin-layer-side surface of the wiring layer, and a covering, formed of a metal layer, which covers a top surface of the bump electrode and a region, at a side surface of the bump electrode, continuous with the top surface excluding a region in contact with the wiring layer.
公开/授权文献
信息查询
IPC分类: