A die bonding apparatus cooperates to a die and a substrate having a die bonding surface. The die bonding apparatus includes a carrier, a die ejecting mechanism and a substrate holding mechanism. The carrier carries the die. The die ejecting mechanism has at least one ejecting unit. The substrate holding mechanism holds the substrate and is disposed opposite to the die ejecting mechanism. The substrate and the carrier move relatively to each other in two dimensions on a plane parallel to the die-bonding surface. The carrier is located between the die ejecting mechanism and the substrate. The ejecting unit pushes against the carrier for transferring the die on the carrier onto the die bonding surface of the substrate.