A fiber sensor package is disclosed. The fiber sensor package includes an interconnection between a first optical fiber and a second optical fiber within a tubing such that the first and second optical fibers are at least partially disposed within that tubing. A bonding material is disposed across an edge of the interconnection around at least a part of the circumferential surfaces of the first and second fibers, holds rigid the interconnection of the first and second optical fibers. The methods of preparing the package, and the examples of systems benefiting from the fiber sensor package of this invention are also described.