Invention Grant
- Patent Title: Package for a light emitting diode and method for fabricating the same
- Patent Title (中): 发光二极管封装及其制造方法
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Application No.: US13214337Application Date: 2011-08-22
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Publication No.: US08137999B2Publication Date: 2012-03-20
- Inventor: Bily Wang , Jonnie Chuang , Hui-Yen Huang
- Applicant: Bily Wang , Jonnie Chuang , Hui-Yen Huang
- Applicant Address: TW Hsin Chu
- Assignee: Harvatek Corporation
- Current Assignee: Harvatek Corporation
- Current Assignee Address: TW Hsin Chu
- Agency: Rosenberg, Klein & Lee
- Main IPC: H01L21/56
- IPC: H01L21/56

Abstract:
A method for fabricating a LED includes: providing a metal substrate; etching the metal substrate to form a first terminal, a second terminal, and a gap between the first terminal and the second terminal, wherein the first terminal has at least one first etching concave and the second terminal has at least one second etching concave; placing at least one LED chip in the at least one first etching concave, wherein the at least one LED chip has a first electrode and a second electrode; electrically connecting the first electrode with the first terminal, and electrically connecting the second electrode with the second terminal; and then covering the at least one LED chip with synthetic polymer, wherein the synthetic polymer is filled into the at least one first etching concave, the at least one second etching concave and the gap to connect the first terminal with the second terminal.
Public/Granted literature
- US20110300649A1 PACKAGE FOR A LIGHT EMITTING DIODE AND METHOD FOR FABRICATING THE SAME Public/Granted day:2011-12-08
Information query
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