Invention Grant
- Patent Title: MOSFETs having stacked metal gate electrodes and method
- Patent Title (中): 具有层叠金属栅电极的MOSFET和方法
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Application No.: US12118919Application Date: 2008-05-12
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Publication No.: US08138076B2Publication Date: 2012-03-20
- Inventor: Cheng-Tung Lin , Yung-Sheng Chiu , Hsiang-Yi Wang , Chia-Lin Yu , Chen-Hua Yu
- Applicant: Cheng-Tung Lin , Yung-Sheng Chiu , Hsiang-Yi Wang , Chia-Lin Yu , Chen-Hua Yu
- Applicant Address: TW Hsin-Chu
- Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee Address: TW Hsin-Chu
- Agency: Slater & Matsil, L.L.P.
- Main IPC: H01L21/3205
- IPC: H01L21/3205 ; H01L21/4763

Abstract:
MOSFETs having stacked metal gate electrodes and methods of making the same are provided. The MOSFET gate electrode includes a gate metal layer formed atop a high-k gate dielectric layer. The metal gate electrode is formed through a low oxygen content deposition process without charged-ion bombardment to the wafer substrate. Metal gate layer thus formed has low oxygen content and may prevent interfacial oxide layer regrowth. The process of forming the gate metal layer generally avoids plasma damage to the wafer substrate.
Public/Granted literature
- US20090280632A1 MOSFETS Having Stacked Metal Gate Electrodes and Method Public/Granted day:2009-11-12
Information query
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