Invention Grant
- Patent Title: Backlight assembly and method of assembling the same
- Patent Title (中): 背光组件及其组装方法
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Application No.: US12468429Application Date: 2009-05-19
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Publication No.: US08142039B2Publication Date: 2012-03-27
- Inventor: Hyun-Chul Bae
- Applicant: Hyun-Chul Bae
- Applicant Address: KR
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR
- Agency: Cantor Colburn LLP
- Priority: KR10-2008-0092248 20080919
- Main IPC: G09F13/04
- IPC: G09F13/04

Abstract:
A backlight assembly with reduced thickness, a reduced number of parts and a reduced probability of causing environmental contamination includes lamps, each lamp including a lamp tube and a pair of lamp electrodes disposed at ends of the lamp tube, respectively, a lamp-driving printed circuit board (“PCB”) which includes a plurality of conductive pads and a plurality of pairs of first socket-fixing grooves and provides a driving voltage to each of the lamps, sockets, each socket including a conductive body which includes a first guide groove, into which each of the lamp electrodes is inserted, and a pair of first fixing protrusions which is inserted into each pair of the first socket-fixing grooves, and a lower case which accommodates the lamp-driving PCB, the sockets, and the lamps, wherein each of the sockets is surface-mounted on a corresponding conductive pad.
Public/Granted literature
- US20100073908A1 BACKLIGHT ASSEMBLY AND METHOD OF ASSEMBLING THE SAME Public/Granted day:2010-03-25
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