发明授权
- 专利标题： Methods and apparatus for removal of films and flakes from the edge of both sides of a substrate using backing pads
- 专利标题（中）： 使用背衬从基板两侧的边缘去除薄膜和薄片的方法和装置
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申请号： US12124142申请日： 2008-05-20
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公开(公告)号： US08142260B2公开(公告)日： 2012-03-27
- 发明人: Eashwer Kollata , Shou-Sung Chang , Zhenhua Zhang , Paul D. Butterfield , Sen-Hou Ko , Antoine P. Manens , Gary C. Ettinger , Ricardo Martinez
- 申请人： Eashwer Kollata , Shou-Sung Chang , Zhenhua Zhang , Paul D. Butterfield , Sen-Hou Ko , Antoine P. Manens , Gary C. Ettinger , Ricardo Martinez
- 申请人地址： US CA Santa Clara
- 专利权人： Applied Materials, Inc.
- 当前专利权人： Applied Materials, Inc.
- 当前专利权人地址： US CA Santa Clara
- 代理机构： Dugan & Dugan, PC
- 主分类号： B24B1/00
- IPC分类号： B24B1/00
摘要：
Apparatus and methods are provided to polish an edge of a substrate. The invention includes a polishing head adapted to retain a backing pad having a selected contour, wherein the polishing head is adapted to press the backing pad against an edge of a substrate. Numerous other aspects are provided.
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