-
1.发明申请METHODS AND APPARATUS FOR USING A BEVEL POLISHING HEAD WITH AN EFFICIENT TAPE ROUTING ARRANGEMENT 审中-公开使用高效光栅路由布置的水平抛光头的方法和装置公开(公告)号：US20080293334A1
公开(公告)日：2008-11-27
申请号：US12124145
申请日：2008-05-21
申请人： Eashwer Kollata , Shou-Sung Chang , Zhenhua Zhang , Paul D. Butterfield , Sen-Hou Ko , Antoine P. Manens , Gary C. Ettinger , Ricardo Martinez
发明人： Eashwer Kollata , Shou-Sung Chang , Zhenhua Zhang , Paul D. Butterfield , Sen-Hou Ko , Antoine P. Manens , Gary C. Ettinger , Ricardo Martinez
IPC分类号： B24B1/00
CPC分类号： B24B9/065 , B24B21/004
摘要： Apparatus and methods are provided to polish an edge of a substrate. The invention includes a polishing head, adapted to contact an edge of a substrate, wherein the polishing head includes one pair of front guide rollers and two pairs of back clamping rollers. Numerous other aspects are provided.
摘要翻译： 提供了设备和方法来抛光衬底的边缘。 本发明包括一个适于接触基片边缘的抛光头，其中抛光头包括一对前引导辊和两对后夹紧辊。 提供了许多其他方面。
-
2.发明授权Methods and apparatus for removal of films and flakes from the edge of both sides of a substrate using backing pads 有权使用背衬从基板两侧的边缘去除薄膜和薄片的方法和装置公开(公告)号：US08142260B2
公开(公告)日：2012-03-27
申请号：US12124142
申请日：2008-05-20
申请人： Eashwer Kollata , Shou-Sung Chang , Zhenhua Zhang , Paul D. Butterfield , Sen-Hou Ko , Antoine P. Manens , Gary C. Ettinger , Ricardo Martinez
发明人： Eashwer Kollata , Shou-Sung Chang , Zhenhua Zhang , Paul D. Butterfield , Sen-Hou Ko , Antoine P. Manens , Gary C. Ettinger , Ricardo Martinez
IPC分类号： B24B1/00
CPC分类号： B24B9/065 , H01L21/02087
摘要： Apparatus and methods are provided to polish an edge of a substrate. The invention includes a polishing head adapted to retain a backing pad having a selected contour, wherein the polishing head is adapted to press the backing pad against an edge of a substrate. Numerous other aspects are provided.
摘要翻译： 提供了设备和方法来抛光衬底的边缘。 本发明包括一种适于保持具有选定轮廓的背衬垫的抛光头，其中抛光头适于将衬垫压靠在衬底的边缘上。 提供了许多其他方面。
-
3.发明申请METHODS AND APPARATUS FOR USING A ROLLING BACKING PAD FOR SUBSTRATE POLISHING 审中-公开用于衬底抛光的滚动支撑垫的方法和装置公开(公告)号：US20080293341A1
公开(公告)日：2008-11-27
申请号：US12124147
申请日：2008-05-21
申请人： Eashwer Kollata , Shou-Sung Chang , Zhenhua Zhang , Paul D. Butterfield , Sen-Hou Ko , Antoine P. Manens , Gary C. Ettinger , Ricardo Martinez
发明人： Eashwer Kollata , Shou-Sung Chang , Zhenhua Zhang , Paul D. Butterfield , Sen-Hou Ko , Antoine P. Manens , Gary C. Ettinger , Ricardo Martinez
CPC分类号： B24B9/065 , B24B21/002
摘要： An apparatus and method are provided to polish an edge of a substrate. The invention includes a polishing head including a backing pad, wherein a width of the backing pad that contacts the substrate edge is larger than a width of a notch in the substrate edge. Numerous other aspects are provided.
摘要翻译： 提供了一种用于抛光衬底边缘的装置和方法。 本发明包括一个包括背衬垫的抛光头，其中背衬垫的接触衬底边缘的宽度大于衬底边缘中的凹口的宽度。 提供了许多其他方面。
-
4.发明申请METHODS AND APPARATUS FOR REMOVAL OF FILMS AND FLAKES FROM THE EDGE OF BOTH SIDES OF A SUBSTRATE USING BACKING PADS 有权使用背面垫片从基板两侧边缘移除薄膜和花瓣的方法和装置公开(公告)号：US20080293340A1
公开(公告)日：2008-11-27
申请号：US12124142
申请日：2008-05-20
申请人： Eashwer Kollata , Shou-Sung Chang , Zhenhua Zhang , Paul D. Butterfield , Sen-Hou Ko , Antoine P. Manens , Gary C. Ettinger , Ricardo Martinez
发明人： Eashwer Kollata , Shou-Sung Chang , Zhenhua Zhang , Paul D. Butterfield , Sen-Hou Ko , Antoine P. Manens , Gary C. Ettinger , Ricardo Martinez
IPC分类号： B24B29/00 , H01L21/302 , B24B1/00
CPC分类号： B24B9/065 , H01L21/02087
摘要： Apparatus and methods are provided to polish an edge of a substrate. The invention includes a polishing head adapted to retain a backing pad having a selected contour, wherein the polishing head is adapted to press the backing pad against an edge of a substrate. Numerous other aspects are provided.
摘要翻译： 提供了设备和方法来抛光衬底的边缘。 本发明包括一种适于保持具有选定轮廓的背衬垫的抛光头，其中抛光头适于将衬垫压靠在衬底的边缘上。 提供了许多其他方面。
-
公开(公告)号：US20090264053A1
公开(公告)日：2009-10-22
申请号：US12427504
申请日：2009-04-21
申请人： Antoine P. Manens , Gary C. Ettinger , Paul D. Butterfield , Shou-Sung Chang , Ricardo Martinez , Eashwer Kollata , Robert A. Ewald , Kuldip Sumbria
发明人： Antoine P. Manens , Gary C. Ettinger , Paul D. Butterfield , Shou-Sung Chang , Ricardo Martinez , Eashwer Kollata , Robert A. Ewald , Kuldip Sumbria
CPC分类号： B24B21/004 , B24B9/065
摘要： Methods and apparatus are provided for housing a polishing tape adapted to polish a substrate. The invention includes a cassette comprising a body portion; and a head portion, wherein the head portion includes: a pair of guide walls; one or more supply rollers positioned between the guide walls in the head portion; and wherein the guide walls are adapted to guide a polishing tape housed in the body over the one or more supply rollers. Numerous other aspects are provided.
摘要翻译： 提供了用于容纳适于抛光衬底的抛光带的方法和装置。 本发明包括一个盒体，包括一个主体部分; 和头部，其中所述头部包括：一对引导壁; 一个或多个供应辊定位在头部中的引导壁之间; 并且其中所述引导壁适于将容纳在所述主体中的抛光带引导到所述一个或多个供给辊上。 提供了许多其他方面。
-
6.发明申请METHODS AND APPARATUS FOR POLISHING A NOTCH OF A SUBSTRATE USING A POLISHING PAD 审中-公开使用抛光垫抛光底板的方法和装置公开(公告)号：US20080293344A1
公开(公告)日：2008-11-27
申请号：US12124137
申请日：2008-05-20
申请人： Gary C. Ettinger , Paul D. Butterfield , Antoine P. Manens , Zhenhua Zhang , Eashwer Kollata , Shou-Sung Chang
发明人： Gary C. Ettinger , Paul D. Butterfield , Antoine P. Manens , Zhenhua Zhang , Eashwer Kollata , Shou-Sung Chang
CPC分类号： B24B21/002 , B24B1/002 , B24B9/065
摘要： Methods and apparatus are provided for polishing a notch of a substrate using a polishing tape. In some embodiments, a polishing head may be provided that is adapted to apply the polishing tape against the notch of the substrate, including: a polishing pad having a cavity adapted to be filled with a pressure-controlled medium; and a tip region having a shape that corresponds to a shape of the notch, wherein the polishing pad is adapted to contact the polishing tape and press the polishing tape against the notch. Numerous other aspects are provided.
摘要翻译： 提供了使用抛光带对衬底的凹口进行抛光的方法和装置。 在一些实施例中，可以提供适于将抛光带应用于衬底的凹口的抛光头，包括：抛光垫，其具有适于填充有压力控制介质的空腔; 以及具有对应于所述凹口的形状的形状的尖端区域，其中所述抛光垫适于接触所述研磨带并将所述研磨带压在所述凹口上。 提供了许多其他方面。
-
7.发明申请METHODS AND APPARATUS TO CONTROL SUBSTRATE BEVEL AND EDGE POLISHING PROFILES OF FILMS 审中-公开控制薄膜的基材水平和边缘抛光轮廓的方法和装置公开(公告)号：US20080293336A1
公开(公告)日：2008-11-27
申请号：US12124128
申请日：2008-05-20
IPC分类号： B24B1/00
CPC分类号： B24B37/042 , B24B9/065
摘要： Methods and apparatus are provided for polishing a film on an edge of a substrate. In some embodiments, a polishing head is provided having a backing plate adapted to press polishing material against a film on an edge of a substrate. The backing plate has a profiled portion adapted to provide a pre-set film profile. Numerous other aspects are provided.
摘要翻译： 提供了用于在衬底的边缘上抛光膜的方法和装置。 在一些实施例中，提供了抛光头，其具有适于将抛光材料压靠在衬底的边缘上的膜上的背板。 背板具有适于提供预设薄膜轮廓的成型部分。 提供了许多其他方面。
-
8.发明申请METHODS AND APPARATUS FOR CONTROLLING THE SIZE OF AN EDGE EXCLUSION ZONE OF A SUBSTRATE 审中-公开用于控制基板边缘排除区尺寸的方法和装置公开(公告)号：US20080293333A1
公开(公告)日：2008-11-27
申请号：US12124132
申请日：2008-05-20
申请人： Zhenhua Zhang , Eashwer Kollata , Sen-Hou Ko
发明人： Zhenhua Zhang , Eashwer Kollata , Sen-Hou Ko
IPC分类号： B24B1/00
CPC分类号： B24B49/02 , B24B37/042
摘要： In some embodiments, a method of controlling a width of an edge exclusion zone of a substrate is provided. The method includes determining a range of angles over which to rotate a polishing head; rotating the polishing head over the determined range of angles to achieve a preset width for an edge exclusion zone of the substrate; and polishing an edge of the substrate with the polishing head. Numerous other aspects are provided.
摘要翻译： 在一些实施例中，提供了控制衬底的边缘排除区的宽度的方法。 该方法包括确定旋转抛光头的角度范围; 在所确定的角度范围内旋转抛光头以实现衬底的边缘排除区的预设宽度; 并用抛光头抛光衬底的边缘。 提供了许多其他方面。
-
公开(公告)号：US20100105290A1
公开(公告)日：2010-04-29
申请号：US12258252
申请日：2008-10-24
CPC分类号： B24B21/18 , B24B21/004 , B24B49/12 , B24D11/00
摘要： Apparatus and methods are provided for polishing a substrate with a polishing tape. The polishing tape includes a first surface adapted to contact a substrate; and a second surface, wherein at least one of the first and second surfaces include a feature adapted to indicate an end condition. Numerous other aspects are provided.
摘要翻译： 提供了用抛光带对衬底进行抛光的装置和方法。 抛光带包括适于接触基板的第一表面; 和第二表面，其中所述第一和第二表面中的至少一个包括适于指示结束条件的特征。 提供了许多其他方面。
-
公开(公告)号：US20070158201A1
公开(公告)日：2007-07-12
申请号：US11326646
申请日：2006-01-06
IPC分类号： C25D21/12
摘要： Embodiments of the invention generally provide a method for electrochemically removing material from a substrate. In one embodiment, a method for electrochemically processing a substrate includes determining a process target for a substrate; electrochemically processing the substrate; determining a deviation between expected and actual process indicators while processing, and changing at least one process variable during processing in response to the variation.
摘要翻译： 本发明的实施方案通常提供一种用于从基底电化学去除材料的方法。 在一个实施例中，用于电化学处理衬底的方法包括确定衬底的工艺目标; 电化学处理基板; 在处理期间确定预期和实际过程指标之间的偏差，以及响应于变化在处理期间改变至少一个过程变量。
-
-
-
-
-
-
-
-
-
搜索结果
10 条记录 (耗时 0.033 秒)
