Invention Grant
- Patent Title: Method to fabricate a damped suspension assembly
- Patent Title (中): 制造阻尼悬挂组件的方法
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Application No.: US12190377Application Date: 2008-08-12
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Publication No.: US08142671B1Publication Date: 2012-03-27
- Inventor: Tzong-Shii Pan
- Applicant: Tzong-Shii Pan
- Applicant Address: US CA Irvine
- Assignee: Western Digital Technologies, Inc.
- Current Assignee: Western Digital Technologies, Inc.
- Current Assignee Address: US CA Irvine
- Main IPC: B22C1/22
- IPC: B22C1/22 ; G11B5/48
Abstract:
A method to fabricate a damped suspension assembly includes providing a suspension assembly including a mounting plate, a bend region, and a load beam. A first thinned area of the load beam is partially-etched. The bend region does not include the first thinned area. A constrained-layer damper is adhered to the first thinned area of the load beam without being adhered to the bend region.
Information query
