发明授权
- 专利标题: Laser beam machining method and semiconductor chip
- 专利标题(中): 激光束加工方法和半导体芯片
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申请号: US12882787申请日: 2010-09-15
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公开(公告)号: US08143141B2公开(公告)日: 2012-03-27
- 发明人: Ryuji Sugiura , Takeshi Sakamoto
- 申请人: Ryuji Sugiura , Takeshi Sakamoto
- 申请人地址: JP Hamamatsu-shi, Shizuoka
- 专利权人: Hamamatsu Photonics K.K.
- 当前专利权人: Hamamatsu Photonics K.K.
- 当前专利权人地址: JP Hamamatsu-shi, Shizuoka
- 代理机构: Drinker Biddle & Reath LLP
- 优先权: JPP2004-329560 20041112
- 主分类号: H01L21/46
- IPC分类号: H01L21/46
摘要:
A laser processing method is provided, which, when cutting a substrate formed with a multilayer part including a plurality of functional devices, makes it possible to cut the multilayer part with a high precision in particular.In a state where a protective tape 22 is attached to the front face 16a of a multilayer part 16, a substrate 4 is irradiated with laser light L while using its rear face 4b as a laser light entrance surface, so as to form a modified region 7 within the substrate 4 along a line to cut, thereby generating a fracture 24 reaching the front face 4a of the substrate 4 from a front-side end part 7a of the modified region 7. Attaching an expandable tape to the rear face 4b of the substrate 4 and expanding it in the state where such a fracture 24 is generated can cut not only the substrate 4 but also the multilayer part 16 on the line to cut, i.e., interlayer insulating films 17a, 17b, with a favorable precision along the line to cut.
公开/授权文献
- US20110001220A1 LASER BEAM MACHINING METHOD AND SEMICONDUCTOR CHIP 公开/授权日:2011-01-06