发明授权
- 专利标题： Wiring board having solder bump and method for manufacturing the same
- 专利标题（中）： 具有焊料凸块的接线板及其制造方法
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申请号： US12405536申请日： 2009-03-17
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公开(公告)号： US08143534B2公开(公告)日： 2012-03-27
- 发明人: Takuya Hando , Hajime Saiki , Kazutaka Tanaka
- 申请人： Takuya Hando , Hajime Saiki , Kazutaka Tanaka
- 申请人地址： JP Nagoya
- 专利权人： NGK Spark Plug Co., Ltd.
- 当前专利权人： NGK Spark Plug Co., Ltd.
- 当前专利权人地址： JP Nagoya
- 代理机构： Stites & Harbison PLLC
- 代理商 Jeffrey A. Haeberlin
- 优先权： JP2008-068593 20080317
- 主分类号： H05K1/11
- IPC分类号： H05K1/11
摘要：
A wiring board has a wiring board main body, a solder resist and solder bumps. The solder resist is formed on a top surface of the wiring board main body, and includes first openings, and second openings that have a diameter larger than that of the first openings. The solder bumps are disposed in the first openings and in the second openings. In addition, top portions of the solder bumps disposed in the first openings have a flat face, while top portions of the solder bumps disposed in the second openings have a non-flat face.
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