公开(公告)号：US08143534B2

公开(公告)日：2012-03-27

申请号：US12405536

申请日：2009-03-17

申请人： Takuya Hando ,  Hajime Saiki ,  Kazutaka Tanaka

发明人： Takuya Hando ,  Hajime Saiki ,  Kazutaka Tanaka

IPC分类号： H05K1/11

CPC分类号： H05K3/3457 ,  H01L23/49811 ,  H01L23/49816 ,  H01L24/16 ,  H01L24/81 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/11334 ,  H01L2224/812 ,  H01L2224/81801 ,  H01L2924/00014 ,  H01L2924/01019 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/14 ,  H01L2924/15312 ,  H05K3/3436 ,  H05K3/3452 ,  H05K3/3489 ,  H05K2201/094 ,  H05K2201/099 ,  H05K2203/0278 ,  H05K2203/0465 ,  Y02P70/613 ,  H01L2224/05599

摘要： A wiring board has a wiring board main body, a solder resist and solder bumps. The solder resist is formed on a top surface of the wiring board main body, and includes first openings, and second openings that have a diameter larger than that of the first openings. The solder bumps are disposed in the first openings and in the second openings. In addition, top portions of the solder bumps disposed in the first openings have a flat face, while top portions of the solder bumps disposed in the second openings have a non-flat face.

摘要翻译： 布线板具有布线板主体，阻焊剂和焊锡凸块。 阻焊剂形成在布线板主体的上表面上，并且包括第一开口和直径大于第一开口直径的第二开口。 焊料凸点设置在第一开口和第二开口中。 此外，设置在第一开口中的焊料凸块的顶部具有平坦表面，而设置在第二开口中的焊料凸块的顶部具有非平坦的表面。

公开(公告)号：US20090229861A1

公开(公告)日：2009-09-17

申请号：US12405536

申请日：2009-03-17

申请人： Takuya Hando ,  Hajime Saiki ,  Kazutaka Tanaka

发明人： Takuya Hando ,  Hajime Saiki ,  Kazutaka Tanaka

IPC分类号： H05K1/02 ,  B05D5/12 ,  B05D3/02 ,  B05D3/12

CPC分类号： H05K3/3457 ,  H01L23/49811 ,  H01L23/49816 ,  H01L24/16 ,  H01L24/81 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/11334 ,  H01L2224/812 ,  H01L2224/81801 ,  H01L2924/00014 ,  H01L2924/01019 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/14 ,  H01L2924/15312 ,  H05K3/3436 ,  H05K3/3452 ,  H05K3/3489 ,  H05K2201/094 ,  H05K2201/099 ,  H05K2203/0278 ,  H05K2203/0465 ,  Y02P70/613 ,  H01L2224/05599

摘要： A wiring board has a wiring board main body, a solder resist and solder bumps. The solder resist is formed on a top surface of the wiring board main body, and includes first openings, and second openings that have a diameter larger than that of the first openings. The solder bumps are disposed in the first openings and in the second openings. In addition, top portions of the solder bumps disposed in the first openings have a flat face, while top portions of the solder bumps disposed in the second openings have a non-flat face.

摘要翻译： 布线板具有布线板主体，阻焊剂和焊锡凸块。 阻焊剂形成在布线板主体的上表面上，并且包括第一开口和直径大于第一开口直径的第二开口。 焊料凸点设置在第一开口和第二开口中。 此外，设置在第一开口中的焊料凸块的顶部具有平坦表面，而设置在第二开口中的焊料凸块的顶部具有非平坦的表面。

公开(公告)号：US08866025B2

公开(公告)日：2014-10-21

申请号：US13355916

申请日：2012-01-23

申请人： Masahiro Inoue ,  Hajime Saiki ,  Atsuhiko Sugimoto ,  Takuya Hando ,  Hidetoshi Wada

发明人： Masahiro Inoue ,  Hajime Saiki ,  Atsuhiko Sugimoto ,  Takuya Hando ,  Hidetoshi Wada

IPC分类号： H05K1/11 ,  H05K1/09 ,  H01L23/32 ,  H01L23/12 ,  H05K3/34 ,  H05K3/46 ,  H05K3/40 ,  H05K3/00 ,  H01L23/00 ,  H05K3/24

CPC分类号： H05K1/111 ,  H01L23/12 ,  H01L23/32 ,  H01L24/00 ,  H01L24/16 ,  H01L24/81 ,  H01L2224/16225 ,  H01L2224/81192 ,  H01L2224/81385 ,  H01L2224/81815 ,  H05K1/113 ,  H05K3/0097 ,  H05K3/244 ,  H05K3/3436 ,  H05K3/4007 ,  H05K3/4682 ,  H05K2201/09745 ,  Y02P70/611

摘要： A multilayer wiring board including a build-up layer comprising a conductor layer and a resin insulation layer that are alternately layered, conductive pads formed on a surface of a resin insulation layer so as to project from the surface, and a solder layer formed over an upper surface of each of the conductive pads is provided. The upper surface of the conductive pads may have a recess, and the entire surface of the solder layer may be situated at an elevated position with respect to an outer periphery portion of the upper surface.

摘要翻译： 一种多层布线基板，包括：交替层叠导体层和树脂绝缘层的堆积层，形成在表面突出的树脂绝缘层的表面的导电性焊盘，以及形成在 提供每个导电焊盘的上表面。 导电焊盘的上表面可以具有凹部，并且焊料层的整个表面可以相对于上表面的外周部分位于升高位置。

公开(公告)号：US09119333B2

公开(公告)日：2015-08-25

申请号：US13399547

申请日：2012-02-17

申请人： Takuya Hando ,  Masahiro Inoue ,  Hajime Saiki ,  Atsuhiko Sugimoto ,  Hidetoshi Wada

发明人： Takuya Hando ,  Masahiro Inoue ,  Hajime Saiki ,  Atsuhiko Sugimoto ,  Hidetoshi Wada

IPC分类号： H05K3/40 ,  H01L23/498 ,  H01L23/00 ,  H01L21/683 ,  H05K3/46 ,  H05K3/00

CPC分类号： H05K3/4007 ,  H01L21/6835 ,  H01L23/49816 ,  H01L23/49822 ,  H01L24/16 ,  H01L24/81 ,  H01L2221/68345 ,  H01L2224/16225 ,  H01L2224/81192 ,  H01L2924/01084 ,  H05K3/0097 ,  H05K3/4682 ,  H05K2201/0367

摘要： A multilayer wiring board including a build-up layer, formed from one or more conductor and resin insulation layers that are layered one on top of the other, having conductive pads formed on a surface of at least one resin insulation layer so as to project from the surface are provided. The conductive pads may each include a columnar portion situated at a lower part thereof and a convex portion situated at a higher part thereof, wherein a surface of the convex portion may assume a continual curved shape. A solder layer may be formed over an upper surface of the conductive pads. Certain embodiments make it possible to minimize or eliminate the concentration of stress on the conductive pads, and may inhibit the occurrence of defective connections to a semiconductor element and infliction of damage to the conductive pads.

摘要翻译： 一种多层布线基板，包括由一层或多层导体和树脂绝缘层形成的堆积层，所述导体和树脂绝缘层层叠在另一层之上，具有形成在至少一层树脂绝缘层的表面上的导电焊盘，以便从 提供表面。 导电垫可以各自包括位于其下部的柱状部分和位于其较高部分的凸部，其中凸部的表面可以呈现连续的弯曲形状。 可以在导电焊盘的上表面上形成焊料层。 某些实施例使得可以最小化或消除导电焊盘上的应力集中，并且可以抑制对半导体元件的不良连接的发生以及对导电焊盘的损坏。

公开(公告)号：US08937256B2

公开(公告)日：2015-01-20

申请号：US13353965

申请日：2012-01-19

申请人： Masahiro Inoue ,  Hajime Saiki ,  Atsuhiko Sugimoto

发明人： Masahiro Inoue ,  Hajime Saiki ,  Atsuhiko Sugimoto

IPC分类号： H01K1/02 ,  H05K13/04 ,  H05K3/34 ,  H01L23/00

CPC分类号： H05K3/3478 ,  H01L24/81 ,  H01L2224/10126 ,  H01L2224/16225 ,  H01L2924/14 ,  H05K3/3436 ,  H05K3/3484 ,  H05K2201/10977 ,  H01L2924/00

摘要： A method for manufacturing a wiring board for mounting an electronic component, a wiring board for mounting an electronic component, and a method for manufacturing an electronic-component-mounted wiring board are provided. A bonding material paste, which can include solder and an electric insulation material made of a resin, can be placed on chip mount terminal pads and heated to fuse the solder and soften the electric insulation material. Subsequently, the solder is solidified to form solder bumps. Further, the electric insulation material is cured on a surface of each of the solder bumps and a surface of a multilayer board around each of the solder bumps to form an electric insulation surface layer. Accordingly, when a chip is mounted to such wiring boards, the electric insulation surface layer minimizes or eliminates the connection between adjacent solder bumps during re-fusing of the solder.

摘要翻译： 本发明提供一种电子部件安装用布线基板的制造方法，电子部件的安装用布线基板以及电子元件搭载布线基板的制造方法。 可以将包括焊料和由树脂制成的电绝缘材料的接合材料糊料放置在芯片安装端子焊盘上并加热以熔化焊料并软化电绝缘材料。 随后，焊料固化形成焊料凸块。 此外，电绝缘材料在每个焊料凸块的表面和每个焊料凸块周围的多层板的表面上固化，以形成电绝缘表面层。 因此，当芯片安装到这种布线板时，电绝缘表面层在焊料的再熔合期间使相邻焊料凸块之间的连接最小化或消除。

公开(公告)号：US07704548B2

公开(公告)日：2010-04-27

申请号：US11739798

申请日：2007-04-25

申请人： Tadahiko Kawabe ,  Masao Kuroda ,  Yasuhiro Sugimoto ,  Hajime Saiki ,  Shinji Yuri ,  Makoto Origuchi

发明人： Tadahiko Kawabe ,  Masao Kuroda ,  Yasuhiro Sugimoto ,  Hajime Saiki ,  Shinji Yuri ,  Makoto Origuchi

IPC分类号： B05D5/12 ,  H01B13/00

CPC分类号： H05K1/185 ,  H01L21/4857 ,  H01L23/13 ,  H01L23/49822 ,  H01L23/50 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16 ,  H01L2224/16235 ,  H01L2924/00014 ,  H01L2924/01078 ,  H01L2924/09701 ,  H01L2924/15311 ,  H05K1/0231 ,  H05K1/112 ,  H05K3/4602 ,  H05K2201/10674 ,  H05K2201/10712 ,  Y10T29/49155 ,  H01L2224/05599

摘要： A method for manufacturing a wiring board which can simplify a manufacturing step. In a preparation step, a core board and an electronic component are prepared. In an insulating layer formation and fixing step, after accommodating the electronic component in an accommodation hole, a lowermost resin insulating layer is formed, and a gap between the electronic component and the core board is filled with a part of the lowermost resin insulating layer so as to fix the electronic component to the core board. In an opening portion formation step, a portion of the lowermost resin insulating layer located directly above the gap between the electronic component and the core board is removed so as to form an opening portion exposing a part of a core board main surface side conductor and a component main surface side electrode. In a main surface side connecting conductor formation step, a main surface side connecting conductor is formed in the opening portion so as to connect the core board main surface side conductor to the component main surface side electrode.

摘要翻译： 一种制造布线板的方法，其可以简化制造步骤。 在准备步骤中，制备核心板和电子部件。 在绝缘层形成和定影步骤中，在将电子部件容纳在容纳孔中之后，形成最下层的树脂绝缘层，并且用最下层的树脂绝缘层的一部分填充电子部件与芯板之间的间隙 以将电子部件固定到核心板。 在开口部形成工序中，除去位于电子部件与芯板之间的间隙正上方的最下层树脂绝缘层的一部分，以形成露出芯板主面侧导体和 部件主表面侧电极。 在主表面侧连接导体形成步骤中，在开口部分形成主表面侧连接导体，以将芯板主表面侧导体连接到部件主表面侧电极。

公开(公告)号：US07202156B2

公开(公告)日：2007-04-10

申请号：US10989515

申请日：2004-11-17

申请人： Hajime Saiki ,  Atsuhiko Sugimoto ,  Mikiya Sakurai

发明人： Hajime Saiki ,  Atsuhiko Sugimoto ,  Mikiya Sakurai

IPC分类号： H01L21/4763

CPC分类号： H05K3/4661 ,  H05K3/108 ,  H05K3/181 ,  H05K3/4602 ,  H05K2201/0209

摘要： A process for manufacturing a wiring substrate, comprising: a step of forming an insulating resin layer containing an inorganic filler over a wiring layer formed on at least one surface of an insulating substrate; a step of forming a thin copper film layer by roughening a surface of the insulating resin layer and plating the same electrolessly with copper; a step of forming an insulating film over the thin copper film layer; a step of forming plated resists profiling a pattern by exposing and developing the insulating film with the pattern; and a step of forming wiring pattern layers by an electrolytic copper plating on a surface of the insulating resin layer having the plated resists formed thereon, wherein at least one of the plated resists has a width of less than 20 μm, and the plated resists include adjoining plated resists in which a clearance between said adjoining plated resists has a width of less than 20 μm.

摘要翻译： 一种布线基板的制造方法，包括：在绝缘基板的至少一个面上形成的布线层上形成含有无机填料的绝缘树脂层的工序; 通过使绝缘树脂层的表面粗糙化并用铜电化而使其形成薄铜膜层的步骤; 在所述薄铜膜层上形成绝缘膜的步骤; 通过用图案曝光和显影绝缘膜来形成电镀抗蚀剂的步骤; 以及在其上形成有电镀抗蚀剂的绝缘树脂层的表面上通过电解铜电镀形成布线图案层的步骤，其中至少一个电镀抗蚀剂具有小于20μm的宽度，并且电镀抗蚀剂包括 邻接的电镀抗蚀剂，其中所述相邻的电镀抗蚀剂之间的间隙具有小于20μm的宽度。

公开(公告)号：US06648211B2

公开(公告)日：2003-11-18

申请号：US09917903

申请日：2001-07-31

申请人： Hajime Saiki ,  Noritaka Miyamoto

发明人： Hajime Saiki ,  Noritaka Miyamoto

IPC分类号： B23K3102

CPC分类号： B23K1/20 ,  H01L2924/0002 ,  H01L2924/15312 ,  H05K3/3426 ,  Y02P70/613 ,  Y10T428/12882 ,  H01L2924/00

摘要： A pin standing resin substrate including a resin substrate having a substantially plate-shaped main surface and composed of one of a resin and a composite material containing a resin, and having a pin-pad exposed from the main surface; and a pin soldered to the pin-pad, wherein the pin has been thermally treated by heating so as to soften the pin. The pin has a rod-like portion composed of a copper base metal and an enlarged diameter portion made of the same material as the rod-like portion. The enlarged diameter portion has a larger diameter than the rod-like portion and is formed at one end of the rod-like portion. At least the enlarged diameter portion is soldered to the pin-pad. Also disclosed is a method of making the pin standing resin substrate, a pin for bonding with the resin substrate, and a method of making the pin.

公开(公告)号：US09132494B2

公开(公告)日：2015-09-15

申请号：US13354043

申请日：2012-01-19

申请人： Masahiro Inoue ,  Hajime Saiki ,  Atsuhiko Sugimoto

发明人： Masahiro Inoue ,  Hajime Saiki ,  Atsuhiko Sugimoto

IPC分类号： H05K1/11 ,  B23K1/00 ,  B23K35/26 ,  B23K35/22 ,  C22C11/06 ,  C22C13/00 ,  H01L23/00 ,  H01L23/498 ,  H01L21/48 ,  H01L21/683 ,  H05K3/46

CPC分类号： B23K1/00 ,  B23K35/22 ,  B23K35/26 ,  C22C11/06 ,  C22C13/00 ,  H01L21/4853 ,  H01L21/6835 ,  H01L23/49811 ,  H01L23/49822 ,  H01L24/00 ,  H01L24/13 ,  H01L24/16 ,  H01L24/81 ,  H01L2221/68318 ,  H01L2221/68331 ,  H01L2221/68345 ,  H01L2221/68386 ,  H01L2224/131 ,  H01L2224/16237 ,  H01L2224/81192 ,  H01L2224/814 ,  H01L2924/15174 ,  H01L2924/15312 ,  H05K3/4682 ,  H05K2201/10318 ,  H01L2924/014

摘要： A wiring board and a method for manufacturing the wiring board reinforced by means of a resin is provided. Embodiments of the wiring board allow for reliable attachment of a connection member, like a socket, to a terminal member. For example, a base of terminal pins is put on pin grid array (PGA) terminal pads, and a bonding material paste including solder and an electric insulation material made of a resin is placed on each of the PGA terminal pads. The bonding material paste is then heated to fuse the solder and soften the electric insulation material. Subsequently, the bonding material paste is cooled to solidify the solder and bond each of the bases to a corresponding PGA terminal pad and form an electric insulation surface layer on an exposed surface of each of solder junctions to which the respective bases are bonded.

摘要翻译： 提供了一种通过树脂加强的布线板和制造布线板的方法。 布线板的实施例允许将连接构件（如插座）可靠地附接到端子构件。 例如，将端子引脚的基座放置在引脚格栅阵列（PGA）端子焊盘上，并且将包含焊料的接合材料浆料和由树脂制成的电绝缘材料放置在每个PGA端子焊盘上。 然后将接合材料浆料加热以熔化焊料并软化电绝缘材料。 随后，将接合材料浆料冷却以固化焊料，并将每个基底结合到相应的PGA端子焊盘上，并在各个基底所接合的每个焊接点的暴露表面上形成电绝缘表面层。

公开(公告)号：US09006580B2

公开(公告)日：2015-04-14

申请号：US13490850

申请日：2012-06-07

申请人： Shinnosuke Maeda ,  Hajime Saiki ,  Satoshi Hirano

发明人： Shinnosuke Maeda ,  Hajime Saiki ,  Satoshi Hirano

IPC分类号： H05K1/03 ,  H05K3/02 ,  H05K3/10 ,  H05K3/40 ,  H05K1/02 ,  H01L23/498 ,  H01L21/48 ,  H01L23/544 ,  H01L21/683 ,  H05K1/11 ,  H05K3/46

CPC分类号： H05K3/4007 ,  H01L21/4857 ,  H01L21/6835 ,  H01L23/49822 ,  H01L23/544 ,  H01L2221/68331 ,  H01L2221/68345 ,  H01L2221/68381 ,  H01L2223/54406 ,  H01L2223/5442 ,  H01L2223/54426 ,  H01L2223/54433 ,  H01L2223/54486 ,  H01L2224/16225 ,  H01L2924/19105 ,  H05K1/0269 ,  H05K1/113 ,  H05K3/4602 ,  H05K3/4682 ,  H05K2201/09781 ,  H05K2203/072 ,  H05K2203/1105 ,  Y10T29/49155

摘要： Disclosed is a method of manufacturing a multilayer wiring substrate having a principal plane of the substrate and a rear plane thereof, having a structure such that a plurality of resin insulating layers and a plurality of conductor layers are laminated, and a plurality of chip component connecting terminals to which chip components are connectable are disposed on the principal plane of the substrate. This method has a feature including a plating layer forming process in which product plating layers which provide the plurality of chip component connecting terminals and a dummy plating layer on the surrounding of the product plating layers are formed on the surface of an exposed outermost resin insulating layer at the principal plane of the substrate. This method permits a thickness dispersion of the chip component connecting terminals to be suppressed and permits a connection reliability thereof to the chip components to be increased.

摘要翻译： 公开了一种多层布线基板的制造方法，该多层布线基板具有基板的主面及其背面，具有层叠多个树脂绝缘层和多个导体层的结构，并且多个芯片部件连接 芯片部件可连接的端子设置在基板的主平面上。 该方法具有包括镀层形成工艺的特征，其中在露出的最外层树脂绝缘层的表面上形成了在产品镀层周围形成有多个芯片部件连接端子和虚拟镀层的产品镀层 在基板的主平面上。 该方法能够抑制芯片部件连接端子的厚度分散，并且能够提高芯片部件的连接可靠性。