发明授权
- 专利标题： Multi-layer embedded capacitance and resistance substrate core
- 专利标题（中）： 多层嵌入式电容和电阻基板芯
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申请号： US12720849申请日： 2010-03-10
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公开(公告)号： US08144480B2公开(公告)日： 2012-03-27
- 发明人: Rabindra N. Das , John M. Lauffer , Irving Memis , Steven G. Rosser
- 申请人： Rabindra N. Das , John M. Lauffer , Irving Memis , Steven G. Rosser
- 申请人地址： US NY Endicott
- 专利权人： Endicott Interconnect Technologies, Inc.
- 当前专利权人： Endicott Interconnect Technologies, Inc.
- 当前专利权人地址： US NY Endicott
- 代理机构： Hinman, Howard & Kattell, LLP
- 代理商 Mark Levy; Lawrence R. Fraley
- 主分类号： H05K1/16
- IPC分类号： H05K1/16
摘要：
A multi-layer imbedded capacitance and resistance substrate core. At least one layer of resistance material is provided. The layer of resistance material has a layer of electrically conductive material embedded therein. At least one layer of capacitance material of high dielectric constant is disposed on the layer of resistance material. Thru-holes are formed by laser.
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