发明授权
- 专利标题： Hybrid composite wafer carrier for wet clean equipment
- 专利标题（中）： 用于湿式清洁设备的混合复合晶片载体
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申请号： US11743516申请日： 2007-05-02
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公开(公告)号： US08146902B2公开(公告)日： 2012-04-03
- 发明人: Wing Lau Cheng , Arnold Kholodenko
- 申请人： Wing Lau Cheng , Helen Cheng, legal representative , Arnold Kholodenko
- 申请人地址： US CA Fremont
- 专利权人： Lam Research Corporation
- 当前专利权人： Lam Research Corporation
- 当前专利权人地址： US CA Fremont
- 代理机构： Martine Penilla Group, LLP
- 主分类号： B23Q3/00
- IPC分类号： B23Q3/00
摘要：
A carrier structure for supporting a substrate when being processed by passing the carrier through a meniscus formed by upper and lower proximity heads is described. The carrier includes a frame having an opening sized for receiving a substrate and a plurality of support pins for supporting the substrate within the opening, the opening being slightly larger than the substrate such that a gap exists between the substrate and the opening. The frame comprises a composite core, a top sheet, a bottom sheet, a layer of aramid fabric between the top sheet and the core and a second layer of aramid fabric between the bottom sheet and the core. The top sheet and the bottom sheet being formed from a polymer material. A method of manufacture is also described.
公开/授权文献
- US20080152922A1 HYBRID COMPOSITE WAFER CARRIER FOR WET CLEAN EQUIPMENT 公开/授权日：2008-06-26
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