A microelectronic assembly is provided which can include an element including a first dielectric layer and a second dielectric layer overlying the first dielectric layer, the second dielectric layer having an exposed surface defining an exposed major surface of the element. A plurality of substantially rigid metal posts can project beyond the exposed surface, the metal posts having ends remote from the exposed surface. The microelectronic assembly can include a microelectronic device which has bond pads and overlies the element. The microelectronic device can have a major surface which confronts the posts. Connections electrically connect the ends of the metal posts with the bond pads of the microelectronic device.