发明授权
- 专利标题： Copper bonding method
- 专利标题（中）： 铜接合法
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申请号： US12541881申请日： 2009-08-14
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公开(公告)号： US08148256B2公开(公告)日： 2012-04-03
- 发明人: François Hébert , Anup Bhalla
- 申请人： François Hébert , Anup Bhalla
- 申请人地址： US CA Sunnyvale
- 专利权人： Alpha and Omega Semiconductor Incorporated
- 当前专利权人： Alpha and Omega Semiconductor Incorporated
- 当前专利权人地址： US CA Sunnyvale
- 代理机构： Schein & Cai LLP
- 代理商 Jingming Cai
- 主分类号： H01L21/44
- IPC分类号： H01L21/44
摘要：
A copper bonding compatible bond pad structure and associated method is disclosed. The device bond pad structure includes a buffering structure formed of regions of interconnect metal and regions of non-conductive passivation material, the buffering structure providing buffering of underlying layers and structures of the device.
公开/授权文献
- US20100024213A1 COPPER BONDING METHOD 公开/授权日：2010-02-04
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