发明授权
- 专利标题： Multilayered printed circuit board and manufacturing method thereof
- 专利标题（中）： 多层印刷电路板及其制造方法
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申请号： US11875486申请日： 2007-10-19
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公开(公告)号： US08148643B2公开(公告)日： 2012-04-03
- 发明人: Naohiro Hirose , Kouta Noda , Hiroshi Segawa , Honjin En , Kiyotaka Tsukada , Naoto Ishida , Kouji Asano , Atsushi Shouda
- 申请人： Naohiro Hirose , Kouta Noda , Hiroshi Segawa , Honjin En , Kiyotaka Tsukada , Naoto Ishida , Kouji Asano , Atsushi Shouda
- 申请人地址： JP Ogaki-shi
- 专利权人： IBIDEN Co., Ltd.
- 当前专利权人： IBIDEN Co., Ltd.
- 当前专利权人地址： JP Ogaki-shi
- 代理机构： Oblon, Spivak, McClelland, Maier & Neustadt, L.L.P.
- 优先权： JP10-249382 19980903; JP10-281940 19980916; JP10-281942 19980916; JP10-303247 19981009; JP11-043514 19990222; JP11-043515 19990222; JP11-060240 19990308; JP11-116246 19990423
- 主分类号： H05K1/03
- IPC分类号： H05K1/03
摘要：
An opening is formed in resin 20 by a laser beam so that a via hole is formed. At this time, copper foil 22, the thickness of which is reduced (to 3 μm) by performing etching to lower the thermal conductivity is used as a conformal mask. Therefore, an opening 20a can be formed in the resin 20 if the number of irradiation of pulse-shape laser beam is reduced. Therefore, occurrence of undercut of the resin 20 which forms an interlayer insulating resin layer can be prevented. Thus, the reliability of the connection of the via holes can be improved.