Invention Grant
US08148738B2 Semiconductor device having an element mounted on a substrate and an electrical component connected to the element
有权
具有安装在基板上的元件和连接到元件的电气元件的半导体器件
- Patent Title: Semiconductor device having an element mounted on a substrate and an electrical component connected to the element
- Patent Title (中): 具有安装在基板上的元件和连接到元件的电气元件的半导体器件
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Application No.: US11812149Application Date: 2007-06-15
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Publication No.: US08148738B2Publication Date: 2012-04-03
- Inventor: Kei Murayama , Mitsutoshi Higashi , Naoyuki Koizumi , Yuichi Taguchi , Akinori Shiraishi , Masahiro Sunohara
- Applicant: Kei Murayama , Mitsutoshi Higashi , Naoyuki Koizumi , Yuichi Taguchi , Akinori Shiraishi , Masahiro Sunohara
- Applicant Address: JP Nagano-shi, Nagano
- Assignee: Shinko Electric Industries Co., Ltd.
- Current Assignee: Shinko Electric Industries Co., Ltd.
- Current Assignee Address: JP Nagano-shi, Nagano
- Agency: Drinker Biddle & Reath LLP
- Priority: JPP.2006-168166 20060616
- Main IPC: H01L31/12
- IPC: H01L31/12

Abstract:
In a semiconductor device 100, a light emitting element 120 has been mounted on an upper plane of a semiconductor substrate 102. In an impurity diffusion region of the semiconductor substrate 102, a P conducting type of a layer 104, and an N layer 106 have been formed, while an N conducting type impurity is implanted to the P layer 104, and then the implanted impurity is diffused to constitute the N layer 106. A zener diode 108 made of a semiconductor device has been formed by the P layer 104 and the N layer 106.
Public/Granted literature
- US20070290329A1 Semiconductor device and method of manufacturing semiconductor device Public/Granted day:2007-12-20
Information query
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