Invention Grant
US08148750B2 Transistor device having asymmetric embedded strain elements and related manufacturing method
有权
具有不对称嵌入式应变元件的晶体管器件及相关制造方法
- Patent Title: Transistor device having asymmetric embedded strain elements and related manufacturing method
- Patent Title (中): 具有不对称嵌入式应变元件的晶体管器件及相关制造方法
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Application No.: US13052969Application Date: 2011-03-21
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Publication No.: US08148750B2Publication Date: 2012-04-03
- Inventor: Rohit Pal , Frank Bin Yang , Michael J. Hargrove
- Applicant: Rohit Pal , Frank Bin Yang , Michael J. Hargrove
- Applicant Address: KY Grand Cayman
- Assignee: GLOBALFOUNDRIES Inc.
- Current Assignee: GLOBALFOUNDRIES Inc.
- Current Assignee Address: KY Grand Cayman
- Agency: Ingrassia Fisher & Lorenz, P.C.
- Main IPC: H01L21/02
- IPC: H01L21/02

Abstract:
Semiconductor transistor devices and related fabrication methods are provided. An exemplary transistor device includes a layer of semiconductor material having a channel region defined therein and a gate structure overlying the channel region. Recesses are formed in the layer of semiconductor material adjacent to the channel region, such that the recesses extend asymmetrically toward the channel region. The transistor device also includes stress-inducing semiconductor material formed in the recesses. The asymmetric profile of the stress-inducing semiconductor material enhances carrier mobility in a manner that does not exacerbate the short channel effect.
Public/Granted literature
- US20110169073A1 TRANSISTOR DEVICE HAVING ASYMMETRIC EMBEDDED STRAIN ELEMENTS AND RELATED MANUFACTURING METHOD Public/Granted day:2011-07-14
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