Invention Grant
- Patent Title: Conductive bumps, wire loops, and methods of forming the same
- Patent Title (中): 导电凸块，线圈及其形成方法
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Application No.: US13063852Application Date: 2010-03-26
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Publication No.: US08152046B2Publication Date: 2012-04-10
- Inventor: Gary S. Gillotti
- Applicant: Gary S. Gillotti
- Applicant Address: US PA Fort Washington
- Assignee: Kulicke and Soffa Industries, Inc.
- Current Assignee: Kulicke and Soffa Industries, Inc.
- Current Assignee Address: US PA Fort Washington
- Agent Christopher M. Spletzer, Sr.
- International Application: PCT/US2010/028824 WO 20100326
- International Announcement: WO2010/120473 WO 20101021
- Main IPC: B23K31/02
- IPC: B23K31/02
Abstract:
A method of forming a conductive bump is provided. The method includes the steps of: (1) bonding a free air ball to a bonding location using a bonding tool to form a bonded ball; (2) raising the bonding tool to a desired height, with a wire clamp open, while paying out wire continuous with the bonded ball; (3) closing the wire clamp; (4) lowering the bonding tool to a smoothing height with the wire clamp still closed; (5) smoothing an upper surface of the bonded ball, with the wire clamp still closed, using the bonding tool; and (6) raising the bonding tool, with the wire clamp still closed, to separate the bonded ball from wire engaged with the bonding tool.
Public/Granted literature
- US20120006882A1 CONDUCTIVE BUMPS, WIRE LOOPS, AND METHODS OF FORMING THE SAME Public/Granted day:2012-01-12
Information query
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