发明授权
- 专利标题: Surface treated electrodeposited copper foil and circuit board
- 专利标题(中): 表面处理电沉积铜箔和电路板
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申请号: US11808049申请日: 2007-06-06
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公开(公告)号: US08153273B2公开(公告)日: 2012-04-10
- 发明人: Takahiro Saito , Sadao Matsumoto , Yuuji Suzuki
- 申请人: Takahiro Saito , Sadao Matsumoto , Yuuji Suzuki
- 申请人地址: JP Tokyo
- 专利权人: The Furukawa Electric Co., Ltd.
- 当前专利权人: The Furukawa Electric Co., Ltd.
- 当前专利权人地址: JP Tokyo
- 代理机构: Arent Fox LLP
- 优先权: JPJP2006-158013 20060607
- 主分类号: B32B15/04
- IPC分类号: B32B15/04 ; B32B15/20
摘要:
A surface treated electrodeposited copper foil having a smooth M surface; a surface treatment is performed on the M surface being an opposite surface of a surface which contacted with a drum in an electrodeposited copper foil, wherein Rz is 1.0 μm or smaller and Ra is 0.2 μm or smaller on the M surface, electrodeposited copper plating is performed to produce a copper foil under a condition of using a copper sulfate bath, wherein a copper concentration is 50 to 80 g/l, a sulfuric acid concentration is 30 to 70 g/l, a solution temperature is 35 to 45° C., a chloride concentration is 0.01 to 30 ppm, an adding concentration of a total of an organic sulfur based compound, low molecular weight glue and polymeric polysaccharide is 0.1 to 100 ppm and TOC is 400 ppm or smaller, and a current density is 20 to 50 A/dm2.