公开(公告)号：US08153273B2

公开(公告)日：2012-04-10

申请号：US11808049

申请日：2007-06-06

申请人： Takahiro Saito ,  Sadao Matsumoto ,  Yuuji Suzuki

发明人： Takahiro Saito ,  Sadao Matsumoto ,  Yuuji Suzuki

IPC分类号： B32B15/04 ,  B32B15/20

CPC分类号： H05K3/384 ,  H05K2201/0355 ,  H05K2203/0723 ,  Y10T428/12431 ,  Y10T428/12569 ,  Y10T428/12903

摘要： A surface treated electrodeposited copper foil having a smooth M surface; a surface treatment is performed on the M surface being an opposite surface of a surface which contacted with a drum in an electrodeposited copper foil, wherein Rz is 1.0 μm or smaller and Ra is 0.2 μm or smaller on the M surface, electrodeposited copper plating is performed to produce a copper foil under a condition of using a copper sulfate bath, wherein a copper concentration is 50 to 80 g/l, a sulfuric acid concentration is 30 to 70 g/l, a solution temperature is 35 to 45° C., a chloride concentration is 0.01 to 30 ppm, an adding concentration of a total of an organic sulfur based compound, low molecular weight glue and polymeric polysaccharide is 0.1 to 100 ppm and TOC is 400 ppm or smaller, and a current density is 20 to 50 A/dm2.

摘要翻译： 具有光滑M表面的经表面处理的电沉积铜箔; 在M表面上进行表面处理，M表面是与电沉积铜箔中的鼓接触的表面的相对表面，其中Rz为1.0μm以下，Ra为50μm以下，电镀铜为 在使用硫酸铜浴的条件下进行铜箔的制造，铜浓度为50〜80g / l，硫酸浓度为30〜70g / l，溶液温度为35〜45℃。 氯化物浓度为0.01〜30ppm，有机硫系化合物，低分子量胶和聚合多糖的总添加浓度为0.1〜100ppm，TOC为400ppm以下，电流密度为20〜 50 A / dm2。

公开(公告)号：US20070287020A1

公开(公告)日：2007-12-13

申请号：US11808049

申请日：2007-06-06

申请人： Takahiro Saito ,  Sadao Matsumoto ,  Yuuji Suzuki

发明人： Takahiro Saito ,  Sadao Matsumoto ,  Yuuji Suzuki

IPC分类号： C22C9/00

CPC分类号： H05K3/384 ,  H05K2201/0355 ,  H05K2203/0723 ,  Y10T428/12431 ,  Y10T428/12569 ,  Y10T428/12903

摘要： To provide a surface treated electrodeposited copper foil having a smooth M surface with less asperity on the surface instead of an S surface affected by stripes transferred from a surface drum; a surface treatment is performed on the M surface being an opposite surface of a surface which contacted with a drum in an electrodeposited copper foil, wherein Rz is 1.0 μm or smaller and Ra is 0.2 μm or smaller on the M surface, electrodeposited copper plating is performed to produce a copper foil under a condition of using a copper sulfate bath, wherein a copper concentration is 50 to 80 g/l, a sulfuric acid concentration is 30 to 70 g/l, a solution temperature is 35 to 45° C., a chloride concentration is 0.01 to 30 ppm, an adding concentration of a total of an organic sulfur based compound, low molecular weight glue and polymeric polysaccharide is 0.1 to 100 ppm and TOC (total organic carbon) is 400 ppm or smaller, and a current density is 20 to 50 A/dm2, and a surface treatment is performed on an M surface of the copper foil to attain Rz of 1.0 μm or smaller and Ra of 0.2 μm or smaller on the M surface.

摘要翻译： 提供具有光滑M表面的表面处理电沉积铜箔，而不是表面受到从表面转鼓传送的条纹影响的S表面; 在M表面上进行表面处理，M表面是与电沉积铜箔中的滚筒接触的表面的相对表面，其中Rz为1.0μm或更小，并且Ra为0.2μm或更小，电沉积铜镀层为 在使用硫酸铜浴的条件下进行铜箔的制造，铜浓度为50〜80g / l，硫酸浓度为30〜70g / l，溶液温度为35〜45℃。 氯化物浓度为0.01〜30ppm，有机硫系化合物，低分子量胶和聚合多糖的总添加浓度为0.1〜100ppm，TOC（总有机碳）为400ppm以下， 电流密度为20〜50A / dm 2，对铜箔的M面进行表面处理，使M表面的Rz为1.0μm以下，Ra为0.2μm以下。

公开(公告)号：US07215235B2

公开(公告)日：2007-05-08

申请号：US10819929

申请日：2004-04-08

申请人： Akira Matsuda ,  Yuuji Suzuki ,  Hideo Otsuka ,  Yuuki Kikuchi ,  Sadao Matsumoto

发明人： Akira Matsuda ,  Yuuji Suzuki ,  Hideo Otsuka ,  Yuuki Kikuchi ,  Sadao Matsumoto

IPC分类号： H01C1/012

CPC分类号： H01C17/065 ,  H05K1/167 ,  H05K3/384 ,  H05K2201/0355 ,  H05K2203/0361 ,  H05K2203/0723

摘要： A conductive substrate with a resistance layer comprising a substantially flat high conductivity substrate roughening treated on its surface by a resistance component and provided with a resistance layer by the resistance component so as to enable the interface between the high conductivity substrate and resistance component layer to be substantially flattened, enable acquisition of a thin film resistance layer with a stable resistance after dissolving away the high conductivity substrate, and able to maintain the peel strength with the insulating support, and a resistance board using the same.

摘要翻译： 一种具有电阻层的导电性基板，其特征在于，具有通过电阻部件在其表面上被电阻成分处理的基本平坦的高导电性基板粗糙化，并且通过所述电阻部件设置有电阻层，使得能够使高导电性基板和电阻成分层之间的界面成为 基本平坦化，能够在剥离高导电性基材后能够获得具有稳定电阻的薄膜电阻层，并且能够与绝缘支撑体一起保持剥离强度，以及使用其的电阻板。

公开(公告)号：US07794578B2

公开(公告)日：2010-09-14

申请号：US10719020

申请日：2003-11-24

申请人： Akira Matsuda ,  Yuuji Suzuki ,  Hideo Otsuka ,  Yuuki Kikuchi ,  Sadao Matsumoto

发明人： Akira Matsuda ,  Yuuji Suzuki ,  Hideo Otsuka ,  Yuuki Kikuchi ,  Sadao Matsumoto

IPC分类号： C25D3/56

CPC分类号： H05K1/167 ,  C25D3/562 ,  H05K2201/0355 ,  H05K2203/0361 ,  H05K2203/0723 ,  Y10T428/12944

摘要： A plating bath, able to form a resistance layer with a uniform thickness distribution on the roughened surface of a conductive base, including nickel ions and sulfamic acid or its salt as essential components and at least one of phosphoric acid, phosphorous acid, hypophosphorous acid, and salts of the same; a conductive base having a thin resistance layer with a stable resistance, and a resistance circuit board material using the same.

摘要翻译： 一种镀浴，其能够在导电性基体的粗糙化表面上形成具有均匀厚度分布的电阻层，包括镍离子和氨基磺酸或其盐作为必要成分，以及至少一种磷酸，亚磷酸，次磷酸， 及其盐; 具有电阻稳定的薄电阻层的导电性基材和使用该导电性基材的电阻电路基板材料。

公开(公告)号：US20070228443A1

公开(公告)日：2007-10-04

申请号：US11693273

申请日：2007-03-29

申请人： Yuuki KIKUCHI ,  Yuuji Suzuki ,  Sadao Matsumoto ,  Satoru Zama ,  Yoshiaki Ogiwara

发明人： Yuuki KIKUCHI ,  Yuuji Suzuki ,  Sadao Matsumoto ,  Satoru Zama ,  Yoshiaki Ogiwara

IPC分类号： H05K1/03

CPC分类号： H05K1/167 ,  H05K2201/0355 ,  H05K2203/0361 ,  H05K2203/0723 ,  H05K2203/1105 ,  Y10T29/49082

摘要： An inexpensive conductive base material with a thin film resistance layer having small variation of the sheet resistance value and a conductive base material with a resistance layer enabling production of a printed resistor circuit board by stably leaving behind resistance elements, that is, a conductive base material with a thin film resistance layer comprised of a conductive base material having a resistance layer formed on its surface wherein the resistance layer includes Ni containing P and an amorphous and a crystalloid form are mixed together and a conductive base material with a thin film resistance layer comprised of a conductive base material having a resistance layer formed on its surface wherein the resistance layer is a crystalline thin film resistance layer including Ni containing P.

摘要翻译： 具有薄膜电阻层的廉价的导电基材，具有薄的电阻值变化小的导电性基材和具有通过稳定地留下电阻元件而制造印刷电阻电路板的电阻层的导电性基材，即导电性基材 具有薄膜电阻层，其由在其表面上形成有电阻层的导电性基材构成，其中电阻层包括含有P的Ni和非晶态和晶体形式混合在一起，并且具有薄膜电阻层的导电基材包含 具有在其表面上形成的电阻层的导电基材，其中电阻层是包含含Ni的结晶薄膜电阻层。

公开(公告)号：US20050280498A1

公开(公告)日：2005-12-22

申请号：US11153609

申请日：2005-06-16

申请人： Yuuki Kikuchi ,  Akira Matsuda ,  Yuuji Suzuki ,  Sadao Matsumoto

发明人： Yuuki Kikuchi ,  Akira Matsuda ,  Yuuji Suzuki ,  Sadao Matsumoto

IPC分类号： C25D3/56 ,  C25D5/12 ,  C25D5/16 ,  C25D7/06 ,  H05K1/16 ,  H05K3/38 ,  H01C1/012

CPC分类号： C25D7/0614 ,  C25D3/562 ,  C25D5/12 ,  C25D5/16 ,  H05K1/167 ,  H05K3/384 ,  H05K2201/0355 ,  H05K2203/0361 ,  H05K2203/0723

摘要： A conductive base material with resistance layer provided with roughened conductive base material on the surface of which the resistance layer is formed with uniform thickness distribution, and a resistance circuit board material using the same, wherein electrodeposited copper foil having granular crystals is roughening treated on at least one surface to obtain Rz of not more than 2.5 μm and the resistance layer of Ni alloy layer containing at least 8 to 18 wt % of P is formed on the roughening treated side.

摘要翻译： 具有电阻层的导电性基材在其表面上形成均匀厚度分布的电阻层的粗糙导电性基材，以及使用其的电阻电路基板材料，其中具有粒状结晶的电解铜箔在其上进行粗糙化处理 至少一个表面以获得不大于2.5μm的Rz，并且在粗糙化处理侧上形成含有至少8至18重量％的P的Ni合金层的电阻层。

公开(公告)号：US07275795B2

公开(公告)日：2007-10-02

申请号：US10507732

申请日：2003-03-20

申请人： Mitsuhiro Nishina ,  Yuuji Suzuki ,  Tatsuji Miyata

发明人： Mitsuhiro Nishina ,  Yuuji Suzuki ,  Tatsuji Miyata

IPC分类号： B60T8/62

CPC分类号： B60W20/13 ,  B60K6/44 ,  B60K6/48 ,  B60K6/52 ,  B60L7/24 ,  B60T1/10 ,  B60T8/267 ,  B60T13/74 ,  B60T17/043 ,  B60T17/22 ,  B60T2270/602 ,  B60T2270/604 ,  B60T2270/608 ,  B60W10/06 ,  B60W10/08 ,  B60W10/18 ,  B60W10/184 ,  B60W10/26 ,  B60W20/00 ,  B60W30/18127 ,  B60W30/18136 ,  B60W2520/10 ,  B60W2520/26 ,  B60W2540/12 ,  B60W2720/403 ,  Y02T10/6221 ,  Y02T10/623 ,  Y02T10/6265

摘要： A hybrid system for a vehicle which can ensure a braking stability on a slippery road is provided. Therefore, the system is provided with a motor 2 a rotation force of which is transmitted to a rear wheel 7, braking actuators 57, 67 which brake the front wheel 6 and the rear wheel 7, and proportional valves 53, 63 controlling a braking force introduced into each braking actuator 57, 67. A control unit 20 is so provided that the control unit 20 calculates a required braking energy based upon a vehicle operating condition in demanding a braking and operates the motor 2 as a power generator to generate a power so as to produce the calculated braking energy, as well as controls a braking force of the front wheel 6.

摘要翻译： 提供一种用于车辆的混合系统，其可以确保在滑溜的道路上的制动稳定性。 因此，该系统设置有电动机2，其旋转力传递到后轮7，制动前轮6和后轮7的制动致动器57,67以及控制制动力的比例阀53,63 引入每个制动致动器57,67。 控制单元20被设置成使得控制单元20基于车辆操作条件在要求制动时计算所需的制动能量，并且将作为发电机的电动机2运行以产生电力，以产生计算的制动能量，如 以及控制前轮6的制动力。

公开(公告)号：US07892655B2

公开(公告)日：2011-02-22

申请号：US11610799

申请日：2006-12-14

申请人： Yuuji Suzuki ,  Takami Moteki ,  Kazuhiro Hoshino ,  Satoshi Fujisawa ,  Akira Kawakami

发明人： Yuuji Suzuki ,  Takami Moteki ,  Kazuhiro Hoshino ,  Satoshi Fujisawa ,  Akira Kawakami

IPC分类号： B32B15/00

CPC分类号： C25D5/10 ,  B32B7/06 ,  B32B15/08 ,  B32B15/20 ,  B32B2255/06 ,  B32B2255/205 ,  B32B2457/08 ,  H05K3/022 ,  Y10T428/12812 ,  Y10T428/1284 ,  Y10T428/12847 ,  Y10T428/12861 ,  Y10T428/1291 ,  Y10T428/12931 ,  Y10T428/24917

摘要： An ultrathin copper foil with a carrier not causing blistering at a release layer interface, having a low carrier peeling force, friendly to the environment, and enabling easy peeling of a carrier foil and an ultrathin copper foil even under a high temperature environment and a printed circuit board enabling a stable production quality of a base of a printed circuit board for fine pattern applications using the ultrathin copper foil with the carrier, that is, an ultrathin copper foil with a carrier comprising a carrier foil, a release layer, and an ultrathin copper foil, wherein the release layer is formed by a metal A for retaining a release property and a metal B for facilitating plating of the ultrathin copper foil, a content a of the metal A and a content b of the metal B forming the release layer satisfying an equation: 10≦a/(a+b)*100≦70 and a printed circuit board prepared by using such an ultrathin copper foil with a carrier.

摘要翻译： 一种超薄铜箔，其载体不会在剥离层界面引起起泡，具有低的载体剥离力，对环境友好，并且即使在高温环境下也能够容易地剥离载体箔和超薄铜箔，并且印刷 电路板，其能够使用超薄铜箔与载体的精细图案应用的印刷电路板的基底的稳定的生产质量，即具有载体的超薄铜箔，其包含载体箔，剥离层和超薄 铜箔，其中释放层由用于保持剥离性的金属A形成，金属B用于促进超薄铜箔的镀覆，金属A的含量a和形成剥离层的金属B的含量b 满足等式：10＆nlE; a /（a + b）* 100＆nlE; 70以及通过使用这种超薄铜箔与载体制备的印刷电路板。

公开(公告)号：US20070154692A1

公开(公告)日：2007-07-05

申请号：US11610799

申请日：2006-12-14

申请人： Yuuji Suzuki ,  Takami Moteki ,  Kazuhiro Hoshino ,  Satoshi Fujisawa ,  Akira Kawakami

发明人： Yuuji Suzuki ,  Takami Moteki ,  Kazuhiro Hoshino ,  Satoshi Fujisawa ,  Akira Kawakami

IPC分类号： B32B3/00 ,  C25D5/10 ,  B32B7/00

CPC分类号： C25D5/10 ,  B32B7/06 ,  B32B15/08 ,  B32B15/20 ,  B32B2255/06 ,  B32B2255/205 ,  B32B2457/08 ,  H05K3/022 ,  Y10T428/12812 ,  Y10T428/1284 ,  Y10T428/12847 ,  Y10T428/12861 ,  Y10T428/1291 ,  Y10T428/12931 ,  Y10T428/24917

摘要： An ultrathin copper foil with a carrier not causing blistering at a release layer interface, having a low carrier peeling force, friendly to the environment, and enabling easy peeling of a carrier foil and an ultrathin copper foil even under a high temperature environment and a printed circuit board enabling a stable production quality of a base of a printed circuit board for fine pattern applications using the ultrathin copper foil with the carrier, that is, an ultrathin copper foil with a carrier comprising a carrier foil, a release layer, and an ultrathin copper foil, wherein the release layer is formed by a metal A for retaining a release property and a metal B for facilitating plating of the ultrathin copper foil, a content a of the metal A and a content b of the metal B forming the release layer satisfying an equation: 10≦a/(a+b)*100≦70and a printed circuit board prepared by using such an ultrathin copper foil with a carrier.

摘要翻译： 一种超薄铜箔，其载体不会在剥离层界面引起起泡，具有低的载体剥离力，对环境友好，并且即使在高温环境下也能够容易地剥离载体箔和超薄铜箔，并且印刷 电路板，其能够使用超薄铜箔与载体的精细图案应用的印刷电路板的基座的稳定的生产质量，即具有载体的超薄铜箔，其包含载体箔，剥离层和超薄 铜箔，其中释放层由用于保持剥离性的金属A形成，金属B用于促进超薄铜箔的镀覆，金属A的含量a和形成剥离层的金属B的含量b 满足公式：<？in-line-formula description =“In-line formula”end =“lead”？> 10 <= A /（a + b）* 100 <= 70 <？in-line-formula description = “直线公式”end =“tail”？>和打印的c 通过使用这种超薄铜箔与载体制备的电路板。

公开(公告)号：US07223481B2

公开(公告)日：2007-05-29

申请号：US10929471

申请日：2004-08-31

申请人： Yuuji Suzuki ,  Akira Matsuda

发明人： Yuuji Suzuki ,  Akira Matsuda

IPC分类号： B32B15/00

CPC分类号： C25D1/04 ,  H01L2924/0002 ,  H05K3/025 ,  H05K3/384 ,  H05K2201/0355 ,  H05K2201/0723 ,  Y10T428/12028 ,  Y10T428/12472 ,  Y10T428/12493 ,  Y10T428/12514 ,  Y10T428/12535 ,  Y10T428/12778 ,  Y10T428/12806 ,  H01L2924/00

摘要： An object of the present invention is to produce an ultra-thin copper foil with a carrier which has few pinholes and small surface roughness and which has an the thickness of less than 5 μm, and to produce the method of producing the foil, and further to produce a printed circuit board for fine pattern, a multilayer printed circuit board and a chip on film circuit board by using the ultra-thin copper foil with a carrier. The present invention provides an ultra-thin copper foil with a carrier produced by stacking a peeling layer and an ultra thin copper foil in order on the surface of a carrier copper foil which is made smooth so that the mean surface roughness of at least one side is Rz of 0.01 to 2.0 μm by the chemical polishing, the electrochemical dissolution, or the smoothing plating processing method independently, combining two or more, or further combining the mechanical polishing.

摘要翻译： 本发明的目的是制造具有针孔小，表面粗糙度小，厚度小于5μm的载体的超薄铜箔，制造箔的制造方法 通过使用具有载体的超薄铜箔制造精细图案的印刷电路板，多层印刷电路板和薄膜电路板上的芯片。 本发明提供一种具有载体的超薄铜箔，其通过在载体铜箔的表面上依次层叠剥离层和超薄铜箔而制造，该载体铜箔的表面平滑，使得至少一个侧面的平均表面粗糙度 通过化学抛光，电化学溶解或平滑电镀处理方法独立地组合了两个或更多个，或进一步组合机械抛光，Rz为0.01〜2.0μm。