Invention Grant
- Patent Title: Probe needle, method for manufacturing the probe needle and method for constructing a three-dimensional structure
- Patent Title (中): 探针，探针的制造方法以及构造三维结构的方法
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Application No.: US12576111Application Date: 2009-10-08
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Publication No.: US08159256B2Publication Date: 2012-04-17
- Inventor: Tomohisa Hoshino , Hiroyuki Hashimoto , Muneo Harada
- Applicant: Tomohisa Hoshino , Hiroyuki Hashimoto , Muneo Harada
- Applicant Address: JP Tokyo
- Assignee: Tokyo Electron Limited
- Current Assignee: Tokyo Electron Limited
- Current Assignee Address: JP Tokyo
- Agency: Finnegan, Henderson, Farabow, Garrett & Dunner LLP
- Priority: JP2004-251081 20040830
- Main IPC: G01R31/02
- IPC: G01R31/02
Abstract:
A method for manufacturing a probe needle having beams and a contactor placed on tips of the beams comprises preparing a Si wafer 20, forming a seed layer 21 on the Si wafer 20, and forming grooves in a desired shape of the beams on the seed layer 21 by patterning a photoresist 23. Subsequently, the grooves are filled up with metal-plated layers 24a, 24b to form the desired shape of beams.
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