Invention Grant
- Patent Title: Composition for stripping and stripping method
- Patent Title (中): 汽提和汽提方法的组成
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Application No.: US13101973Application Date: 2011-05-05
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Publication No.: US08163095B2Publication Date: 2012-04-24
- Inventor: Ji Sun Lee , Hong Sick Park , Jong Hyun Choung , Sun Young Hong , Bong Kyun Kim , Byeong Jin Lee , Byung Uk Kim , Jong Hyun Jeong , Suk II Yoon , Seong Bae Kim , Sung Gun Shin , Soon Beom Huh , Se Hwan Jung , Doo Young Jang
- Applicant: Ji Sun Lee , Hong Sick Park , Jong Hyun Choung , Sun Young Hong , Bong Kyun Kim , Byeong Jin Lee , Byung Uk Kim , Jong Hyun Jeong , Suk II Yoon , Seong Bae Kim , Sung Gun Shin , Soon Beom Huh , Se Hwan Jung , Doo Young Jang
- Applicant Address: KR
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR
- Agency: Innovation Counsel LLP
- Priority: KR10-2007-0098028 20070928
- Main IPC: C11D7/50
- IPC: C11D7/50

Abstract:
The present invention provides a stripping composition and a stripping method capable of easily stripping a color resist or an organic insulating film formed on a substrate to reuse the substrate when defects are found during a process of forming the color filter or organic insulating film on the substrate. In one embodiment, the stripping composition includes about 0.5 to about 45 wt % of hydroxide compound, about 10 to about 89 wt % of alkyleneglycolalkylether compound, about 5 to about 45 wt % of alkanolamine compound, and about 0.01 to about 5 wt % of inorganic salt compound. Advantageously, the stripping process can be performed without damaging a thin film transistor of a bottom substrate while removing the color resist or organic insulating film.
Public/Granted literature
- US20110206829A1 COMPOSITION FOR STRIPPING AND STRIPPING METHOD Public/Granted day:2011-08-25
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