发明授权
- 专利标题： Functional element package and fabrication method therefor
- 专利标题（中）： 功能元件封装及其制造方法
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申请号： US12531552申请日： 2008-03-17
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公开(公告)号： US08164180B2公开(公告)日： 2012-04-24
- 发明人: Yukito Sato , Joerg Froemel
- 申请人： Yukito Sato , Joerg Froemel
- 申请人地址： JP Tokyo DE Munich
- 专利权人： Ricoh Company, Ltd.,Fraunhofer-Gesellschaft zur Foerderung der Angewandten Forschung E.V.
- 当前专利权人： Ricoh Company, Ltd.,Fraunhofer-Gesellschaft zur Foerderung der Angewandten Forschung E.V.
- 当前专利权人地址： JP Tokyo DE Munich
- 代理机构： Cooper & Dunham LLP
- 优先权： JP2007-070292 20070319; JP2008-013249 20080124
- 国际申请： PCT/JP2008/055347 WO 20080317
- 国际公布： WO2008/123165 WO 20081016
- 主分类号： H01L29/84
- IPC分类号： H01L29/84
摘要：
A functional element package includes a silicon substrate with a functional element having one of a mobile portion and a sensor thereon; a seal member being bonded with the silicon substrate to form an airtightly sealed space therein, and including a step portion in its height direction; a first wiring portion being connected with the functional element and extending from the airtightly sealed space to an outside thereof; a second wiring portion being different from the first wiring portion and extending from the step portion to an upper surface of the seal member; and a bump on the second wiring portion, in which the first wiring portion is bent towards the airtightly sealed space and connected via a photoconductive member with the second wiring portion on the step portion.
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