Invention Grant
- Patent Title: Powder metallurgy sputtering targets and methods of producing same
- Patent Title (中): 粉末冶金溅射靶及其制造方法
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Application No.: US12552386Application Date: 2009-09-02
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Publication No.: US08168118B2Publication Date: 2012-05-01
- Inventor: Christopher A. Michaluk , Shi Yuan , James D. Maguire, Jr.
- Applicant: Christopher A. Michaluk , Shi Yuan , James D. Maguire, Jr.
- Applicant Address: US MA Boston
- Assignee: Cabot Corporation
- Current Assignee: Cabot Corporation
- Current Assignee Address: US MA Boston
- Agency: Kilyk & Bowersox, P.L.L.C.
- Main IPC: B22F1/00
- IPC: B22F1/00

Abstract:
A method of forming a sputtering target and other metal articles having controlled oxygen and nitrogen content levels and the articles so formed are described. The method includes surface-nitriding a deoxidized metal powder and further includes consolidating the powder by a powder metallurgy technique. Preferred metal powders include, but are not limited to, valve metals, including tantalum, niobium, and alloys thereof.
Public/Granted literature
- US20090324439A1 Powder Metallurgy Sputtering Targets and Methods Of Producing Same Public/Granted day:2009-12-31
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