发明授权
US08168503B2 Method for forming an SOI schottky source/drain device to control encroachment and delamination of silicide 有权
用于形成SOI肖特基源极/漏极器件以控制硅化物侵蚀和分层的方法

Method for forming an SOI schottky source/drain device to control encroachment and delamination of silicide
摘要:
A method of fabricating a Schottky field effect transistor is provided that includes providing a substrate having at least a first semiconductor layer overlying a dielectric layer, wherein the first semiconductor layer has a thickness of less than 10.0 nm. A gate structure is formed directly on the first semiconductor layer. A raised semiconductor material is selectively formed on the first semiconductor layer adjacent to the gate structure. The raised semiconductor material is converted into Schottky source and drain regions composed of a metal semiconductor alloy. A non-reacted semiconductor material is present between the Schottky source and drain regions and the dielectric layer.
信息查询
0/0