发明授权
US08168503B2 Method for forming an SOI schottky source/drain device to control encroachment and delamination of silicide
有权
用于形成SOI肖特基源极/漏极器件以控制硅化物侵蚀和分层的方法
- 专利标题: Method for forming an SOI schottky source/drain device to control encroachment and delamination of silicide
- 专利标题(中): 用于形成SOI肖特基源极/漏极器件以控制硅化物侵蚀和分层的方法
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申请号: US12726736申请日: 2010-03-18
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公开(公告)号: US08168503B2公开(公告)日: 2012-05-01
- 发明人: Marwan H. Khater , Christian Lavoie , Bin Yang , Zhen Zhang
- 申请人: Marwan H. Khater , Christian Lavoie , Bin Yang , Zhen Zhang
- 申请人地址: US NY Armonk
- 专利权人: International Business Machines Corporation
- 当前专利权人: International Business Machines Corporation
- 当前专利权人地址: US NY Armonk
- 代理机构: Scully, Scott, Murphy & Presser, P.C.
- 代理商 Louis J. Percello, Esq.
- 主分类号: H01L21/336
- IPC分类号: H01L21/336
摘要:
A method of fabricating a Schottky field effect transistor is provided that includes providing a substrate having at least a first semiconductor layer overlying a dielectric layer, wherein the first semiconductor layer has a thickness of less than 10.0 nm. A gate structure is formed directly on the first semiconductor layer. A raised semiconductor material is selectively formed on the first semiconductor layer adjacent to the gate structure. The raised semiconductor material is converted into Schottky source and drain regions composed of a metal semiconductor alloy. A non-reacted semiconductor material is present between the Schottky source and drain regions and the dielectric layer.
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