Invention Grant
US08168503B2 Method for forming an SOI schottky source/drain device to control encroachment and delamination of silicide
有权
用于形成SOI肖特基源极/漏极器件以控制硅化物侵蚀和分层的方法
- Patent Title: Method for forming an SOI schottky source/drain device to control encroachment and delamination of silicide
- Patent Title (中): 用于形成SOI肖特基源极/漏极器件以控制硅化物侵蚀和分层的方法
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Application No.: US12726736Application Date: 2010-03-18
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Publication No.: US08168503B2Publication Date: 2012-05-01
- Inventor: Marwan H. Khater , Christian Lavoie , Bin Yang , Zhen Zhang
- Applicant: Marwan H. Khater , Christian Lavoie , Bin Yang , Zhen Zhang
- Applicant Address: US NY Armonk
- Assignee: International Business Machines Corporation
- Current Assignee: International Business Machines Corporation
- Current Assignee Address: US NY Armonk
- Agency: Scully, Scott, Murphy & Presser, P.C.
- Agent Louis J. Percello, Esq.
- Main IPC: H01L21/336
- IPC: H01L21/336

Abstract:
A method of fabricating a Schottky field effect transistor is provided that includes providing a substrate having at least a first semiconductor layer overlying a dielectric layer, wherein the first semiconductor layer has a thickness of less than 10.0 nm. A gate structure is formed directly on the first semiconductor layer. A raised semiconductor material is selectively formed on the first semiconductor layer adjacent to the gate structure. The raised semiconductor material is converted into Schottky source and drain regions composed of a metal semiconductor alloy. A non-reacted semiconductor material is present between the Schottky source and drain regions and the dielectric layer.
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