发明授权
US08168980B2 Active matrix substrate, display device, television receiver, manufacturing method of active matrix substrate, forming method of gate insulating film 有权
有源矩阵基板,显示装置,电视接收机,有源矩阵基板的制造方法,栅极绝缘膜的形成方法

  • 专利标题: Active matrix substrate, display device, television receiver, manufacturing method of active matrix substrate, forming method of gate insulating film
  • 专利标题(中): 有源矩阵基板,显示装置,电视接收机,有源矩阵基板的制造方法,栅极绝缘膜的形成方法
  • 申请号: US12162042
    申请日: 2006-11-07
  • 公开(公告)号: US08168980B2
    公开(公告)日: 2012-05-01
  • 发明人: Toshihide TsubataMasanori Takeuchi
  • 申请人: Toshihide TsubataMasanori Takeuchi
  • 申请人地址: JP Osaka
  • 专利权人: Sharp Kabushiki Kaisha
  • 当前专利权人: Sharp Kabushiki Kaisha
  • 当前专利权人地址: JP Osaka
  • 代理机构: Nixon & Vanderhye P.C.
  • 优先权: JP2006-049363 20060224
  • 国际申请: PCT/JP2006/322151 WO 20061107
  • 国际公布: WO2007/097074 WO 20070830
  • 主分类号: H01L29/15
  • IPC分类号: H01L29/15
Active matrix substrate, display device, television receiver, manufacturing method of active matrix substrate, forming method of gate insulating film
摘要:
In an active matrix substrate of the present invention, a gate insulating film for covering a gate electrode of each transistor has a thin portion, having a reduced film thickness, which is provided on a part overlapped on the gate electrode, and the thin portion is formed by using the gate electrode, on which the thin portion is overlapped, as a mask, and each transistor has a first drain electrode section and a second drain electrode section which are respectively provided on both sides of a source electrode, and the thin portion has two edges opposite to each other, and the first drain electrode section is overlapped on the one edge, and the second drain electrode section is overlapped on the other edge. This makes it possible to provide an active matrix substrate which realizes high display quality while suppressing unevenness of parasitic capacitances (particularly, Cgd) of TFTs in the active matrix substrate whose each TFT has a thin portion in its gate insulating film.
信息查询
IPC分类:
H 电学
H01 基本电气元件
H01L 半导体器件;其他类目中不包括的电固体器件(使用半导体器件的测量入G01;一般电阻器入H01C;磁体、电感器、变压器入H01F;一般电容器入H01G;电解型器件入H01G9/00;电池组、蓄电池入H01M;波导管、谐振器或波导型线路入H01P;线路连接器、汇流器入H01R;受激发射器件入H01S;机电谐振器入H03H;扬声器、送话器、留声机拾音器或类似的声机电传感器入H04R;一般电光源入H05B;印刷电路、混合电路、电设备的外壳或结构零部件、电气元件的组件的制造入H05K;在具有特殊应用的电路中使用的半导体器件见应用相关的小类)
H01L29/00 专门适用于整流、放大、振荡或切换,并具有至少一个电位跃变势垒或表面势垒的半导体器件;具有至少一个电位跃变势垒或表面势垒,例如PN结耗尽层或载流子集结层的电容器或电阻器;半导体本体或其电极的零部件(H01L31/00至H01L47/00,H01L51/05优先;除半导体或其电极之外的零部件入H01L23/00;由在一个共用衬底内或其上形成的多个固态组件组成的器件入H01L27/00)
H01L29/02 .按其半导体本体的特征区分的
H01L29/12 ..按其构成材料的特征区分的
H01L29/15 ... · ·带有周期性或准周期性电势变化的结构,如多量子阱、超晶格(应用于光控制的这种结构入G02F1/017;应用于半导体激光器的入H01S5/34)
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