发明授权
- 专利标题： Interconnect structures having lead-free solder bumps
- 专利标题（中）： 具有无铅焊料凸块的互连结构
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申请号： US12537001申请日： 2009-08-06
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公开(公告)号： US08169076B2公开(公告)日： 2012-05-01
- 发明人: Mirng-Ji Lii , Chien-Hsiun Lee , Chen-Hua Yu , Shin-Puu Jeng , Chin-Yu Ku
- 申请人： Mirng-Ji Lii , Chien-Hsiun Lee , Chen-Hua Yu , Shin-Puu Jeng , Chin-Yu Ku
- 申请人地址： TW Hsin-Chu
- 专利权人： Taiwan Semiconductor Manufacturing Co., Ltd.
- 当前专利权人： Taiwan Semiconductor Manufacturing Co., Ltd.
- 当前专利权人地址： TW Hsin-Chu
- 代理机构： Slater & Matsil, L.L.P.
- 主分类号： H01L23/498
- IPC分类号： H01L23/498
摘要：
An integrated circuit structure includes a semiconductor substrate, and a polyimide layer over the semiconductor substrate. An under-bump-metallurgy (UBM) has a first portion over the polyimide layer, and a second portion level with the polyimide layer. A first solder bump and a second solder bump are formed over the polyimide layer, with a pitch between the first solder bump and the second solder bump being no more than 150 μm. A width of the UBM equals one-half of the pitch plus a value greater than 5 μm.
公开/授权文献
- US20100314756A1 Interconnect Structures Having Lead-Free Solder Bumps 公开/授权日：2010-12-16
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