Invention Grant
- Patent Title: Electromagnetic bandgap structure and printed circuit board
- Patent Title (中): 电磁带隙结构和印刷电路板
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Application No.: US12010561Application Date: 2008-01-25
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Publication No.: US08169790B2Publication Date: 2012-05-01
- Inventor: Han Kim , Je-Gwang Yoo , Chang-Sup Ryu
- Applicant: Han Kim , Je-Gwang Yoo , Chang-Sup Ryu
- Applicant Address: KR Suwon
- Assignee: Samsung Electro-Mechanics Co., Ltd.
- Current Assignee: Samsung Electro-Mechanics Co., Ltd.
- Current Assignee Address: KR Suwon
- Priority: KR10-2007-0079261 20070807
- Main IPC: H05K7/00
- IPC: H05K7/00

Abstract:
An electromagnetic bandgap structure and a printed circuit board having the electromagnetic bandgap that intercepts the transfer of a signal ranging a frequency band are disclosed. The electromagnetic bandgap structure includes a metal layer; a dielectric layer, stacked on the metal layer; at least two metal plates, stacked on the same planar surface of the dielectric layer; and a stitching via, connecting the adjacent metal plates. The stitching via passes through the dielectric layer, and a part of the stitching via is placed on the same planar surface of the metal layer. With the present invention, the electromagnetic bandgap can decrease the noise of a particular frequency by having a compact size and a low bandgap frequency.
Public/Granted literature
- US20090039984A1 Electromagnetic bandgap structure and printed circuit board Public/Granted day:2009-02-12
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