发明授权
- 专利标题： Particle reduction on surfaces of chemical vapor deposition processing apparatus
- 专利标题（中）： 化学气相沉积处理装置表面的减少颗粒
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申请号： US11498606申请日： 2006-08-02
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公开(公告)号： US08173228B2公开(公告)日： 2012-05-08
- 发明人: Soo Young Choi , John M. White , Beom Soo Park , Dong Kil Yim
- 申请人： Soo Young Choi , John M. White , Beom Soo Park , Dong Kil Yim
- 申请人地址： US CA Santa Clara
- 专利权人： Applied Materials, Inc.
- 当前专利权人： Applied Materials, Inc.
- 当前专利权人地址： US CA Santa Clara
- 代理机构： Patterson & Sheridan, LLP
- 主分类号： H05H1/24
- IPC分类号： H05H1/24 ; B05D3/00 ; B05C13/00
摘要：
A method of reducing the amount of particulates generated from the surface of a processing component used during plasma enhanced chemical vapor deposition of thin films. The body of the processing component comprises an aluminum alloy, and an exterior surface of said processing component is texturized to increase the amount of surface area present on the exterior surface. The texturizing process includes at least one step in which the surface to be texturized is bead blasted or chemically grained, so that the surface roughness of the texturized surface ranges from about 50 μ-inch Ra to about 1,000 μ-inch Ra.
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