Invention Grant
- Patent Title: Housing comprising a device for fixing an electronic component
- Patent Title (中): 壳体包括用于固定电子部件的装置
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Application No.: US12531776Application Date: 2008-03-19
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Publication No.: US08173912B2Publication Date: 2012-05-08
- Inventor: Turhan Büyükbas , Jürgen Rietsch , Helmut Karrer , Jürgen Henniger , Matthias Gramann , Matthias Wieczorek , Klaus Scharrer , Peter Guth , Dirk Trodler
- Applicant: Turhan Büyükbas , Jürgen Rietsch , Helmut Karrer , Jürgen Henniger , Matthias Gramann , Matthias Wieczorek , Klaus Scharrer , Peter Guth , Dirk Trodler
- Applicant Address: DE
- Assignee: Conti Temic Microelectronic GmbH
- Current Assignee: Conti Temic Microelectronic GmbH
- Current Assignee Address: DE
- Agency: RatnerPrestia
- Priority: DE102007013696 20070319
- International Application: PCT/DE2008/000463 WO 20080319
- International Announcement: WO2008/113336 WO 20080925
- Main IPC: H01R13/502
- IPC: H01R13/502

Abstract:
A housing for retaining an electronic component, including a lid and a lower part made of synthetic material, wherein the lid is joined in a force-fit manner to the lower part by clamping geometry, and in order to affix the electronic component in position, the lid applies a specified force (F) to the electronic component after being joined to the lower part due to its design. Here, the lid is designed in such a manner that the force (F) applied lies within a specified force range (B), and that the clamping geometry comprises a groove on the lower part and a ridge on the lid which grips into the groove, wherein a clamp web on the lower part or on the lid is arranged in such a manner that the lid is removably clamped to the lower part after being joined to the lower part with a force (F) which acts parallel to the clamping force (KF).
Public/Granted literature
- US20100175921A1 Housing Comprising A Device For Fixing An Electronic Component Public/Granted day:2010-07-15
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