发明授权
- 专利标题: Split gate device and method for forming
- 专利标题(中): 分体浇口装置及成型方法
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申请号: US11926323申请日: 2007-10-29
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公开(公告)号: US08178406B2公开(公告)日: 2012-05-15
- 发明人: Sung-Taeg Kang , Gowrishankar L. Chindalore
- 申请人: Sung-Taeg Kang , Gowrishankar L. Chindalore
- 申请人地址: US TX Austin
- 专利权人: Freescale Semiconductor, Inc.
- 当前专利权人: Freescale Semiconductor, Inc.
- 当前专利权人地址: US TX Austin
- 代理商 Joanna G. Chiu; James L. Clingan, Jr.
- 主分类号: H01L27/088
- IPC分类号: H01L27/088 ; H01L27/108
摘要:
A method of making a semiconductor device on a semiconductor layer includes forming a select gate, a recess, a charge storage layer, and a control gate. The select gate is formed have a first sidewall over the semiconductor layer. The recess is formed in the semiconductor layer adjacent to the first sidewall of the select gate. The thin layer of charge storage material is formed in which a first portion of the thin layer of charge storage material is formed in the first recess and a second portion of the thin layer of charge storage material is formed along the first sidewall of the first select gate. The control gate is formed over the first portion of the thin layer of charge storage material. The result is a semiconductor device useful a memory cell.
公开/授权文献
- US20090108325A1 SPLIT GATE DEVICE AND METHOD FOR FORMING 公开/授权日:2009-04-30
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