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US08178901B2 Integrated circuit assembly with passive integration substrate for power and ground line routing on top of an integrated circuit chip 有权
集成电路组件，具有无源集成基板，用于集成电路芯片顶部的电源和接地线路由

Integrated circuit assembly with passive integration substrate for power and ground line routing on top of an integrated circuit chip
Abstract:
An integrated circuit assembly (ICA) comprises: a digital and/or analog integrated circuit (S1) having a core with input and/or output pins and at least one power supply connection pad (PP) and one ground connection pad (GP) connected to a chosen one of the input and/or output pins and respectively connected to power supply and ground connection zones (MZ1) of a printed circuit board (PCB), and a passive integration substrate (S2) set on top of the digital and/or analog integrated circuit (S1) and comprising i) at least first and second input zones respectively connected to the ground (GP) and power supply (PP) connection pads to be fed with input ground and supply voltages, ii) input and/or output zones connected to chosen core input and/or output pins, and Ëi) a passive integrated circuit (PIC) connected to the first and second input zones and arranged to feed the substrate input and/or output zones with chosen ground and supply voltages defined from the input ground and supply voltages.
Abstract(Chinese):

集成电路组件（ICA）包括：数字和/或模拟集成电路（S1），其具有带有输入和/或输出引脚的核心，以及连接至少一个电源连接焊盘（PP）和一个接地连接焊盘（GP） 分别连接到印刷电路板（PCB）的电源和接地连接区域（MZ1）中的所选择的一个输入和/或输出引脚以及设置在数字和/或输出引脚上的无源集成基板（S2） 或模拟集成电路（S1），并且包括i）分别连接到接地（GP）和电源（PP）连接焊盘的至少第一和第二输入区域，以供给输入的接地和电源电压; ii）输入和/或 输出区域，连接到所选择的核心输入和/或输出引脚，以及Ëi）连接到第一和第二输入区域的无源集成电路（PIC），并且被布置为馈送所选择的接地和电源电压的基板输入和/或输出区域 从输入接地和电源电压 年龄

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