Invention Grant
US08178954B2 Structure of mixed semiconductor encapsulation structure with multiple chips and capacitors
有权
具有多个芯片和电容器的混合半导体封装结构的结构
- Patent Title: Structure of mixed semiconductor encapsulation structure with multiple chips and capacitors
- Patent Title (中): 具有多个芯片和电容器的混合半导体封装结构的结构
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Application No.: US12693446Application Date: 2010-01-26
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Publication No.: US08178954B2Publication Date: 2012-05-15
- Inventor: Yan Xun Xue , Anup Bhalla , Jun Lu
- Applicant: Yan Xun Xue , Anup Bhalla , Jun Lu
- Applicant Address: US CA Sunnyvale
- Assignee: Alpha & Omega Semiconductor, Inc.
- Current Assignee: Alpha & Omega Semiconductor, Inc.
- Current Assignee Address: US CA Sunnyvale
- Agency: Chemily LLC
- Agent Chein-Hwa Tsao
- Main IPC: H01L23/495
- IPC: H01L23/495 ; H01L23/48 ; H01L23/02
Abstract:
A semiconductor package for power converter application comprises a low-side MOSFET chip and a high-side MOSFET chip stacking one over the other. The semiconductor package may further enclose a capacitor whereas the capacitor may be a discrete component or an integrated component on chip level with the low-side MOSFET. The semiconductor package may further comprise a PIC chip to provide a complete power converter on semiconductor chip assembly package level.
Public/Granted literature
- US20110024884A1 Structure of Mixed Semiconductor Encapsulation Structure with Multiple Chips and Capacitors Public/Granted day:2011-02-03
Information query
IPC分类:
