A method of configuring a stacked integrated circuit (“IC”) having a first IC die with configurable logic and a second IC die electrically coupled to the first IC die through an array of inter-chip contacts includes: providing a frame having frame data and a frame address in a frame header to the first IC die; storing the frame data in a frame data register of the first IC die; processing the frame header to determine whether a frame destination is in the first IC die or the second IC die; in response to determining that the frame destination is in the second IC die, providing the frame address to the second IC die through an inter-chip frame address bus including a first plurality of the array of inter-chip contacts; and writing the frame data from the frame data register of the first IC die to the frame destination through an inter-chip frame data bus including a second plurality of the array of inter-chip contacts.