Invention Grant
- Patent Title: Cut-edge positioning type soldering structure and method for preventing pin deviation
- Patent Title (中): 尖端定位型焊接结构及防止引脚偏移的方法
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Application No.: US12841336Application Date: 2010-07-22
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Publication No.: US08179690B2Publication Date: 2012-05-15
- Inventor: Hsiang-Chih Ni , Ching-Feng Hsieh
- Applicant: Hsiang-Chih Ni , Ching-Feng Hsieh
- Applicant Address: TW
- Assignee: Askey Computer Corp.
- Current Assignee: Askey Computer Corp.
- Current Assignee Address: TW
- Agency: Schmeiser, Olsen & Watts, LLP
- Priority: TW99119883A 20100618
- Main IPC: H05K7/06
- IPC: H05K7/06 ; H05K3/34
Abstract:
A cut-edge positioning type soldering structure and a method for preventing a pin deviation can prevent a plurality of pins of an electronic component from being deviated when the pins are soldered onto a printed circuit board by a solder, and each of at least two solder pads includes at least two cut edges, and the solder pads are installed in an alignment direction on the printed circuit board, such that the cut-edge positioning type soldering structure and the method for preventing a pin deviation can improve the efficiency of manufacturing processes and reduce the manufacturing cost.
Public/Granted literature
- US20110310578A1 CUT-EDGE POSITIONING TYPE SOLDERING STRUCTURE AND METHOD FOR PREVENTING PIN DEVIATION Public/Granted day:2011-12-22
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