Invention Grant
- Patent Title: Bundle authentication system and method
- Patent Title (中): 捆绑认证系统和方法
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Application No.: US12629399Application Date: 2009-12-02
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Publication No.: US08181030B2Publication Date: 2012-05-15
- Inventor: Hyun Woo Lee , Kwi Hoon Kim , Won Ryu , Sou Hwan Jung , Ki Hun Hong
- Applicant: Hyun Woo Lee , Kwi Hoon Kim , Won Ryu , Sou Hwan Jung , Ki Hun Hong
- Applicant Address: KR Daejeon KR Seoul
- Assignee: Electronics and Telecommunications Research Institute,Soongsil University Foundation of University-Industry Cooperation
- Current Assignee: Electronics and Telecommunications Research Institute,Soongsil University Foundation of University-Industry Cooperation
- Current Assignee Address: KR Daejeon KR Seoul
- Agency: Nelson Mullins Riley & Scarborough LLP
- Agent EuiHoon Lee, Esq.
- Priority: KR10-2008-0121510 20081202; KR10-2009-0046023 20090526
- Main IPC: G06F21/00
- IPC: G06F21/00 ; H04M1/66 ; H04M1/68 ; H04M3/16
Abstract:
There is provided a bundle authentication system and method that can perform network access authentication and authentication at a service request in a next generation network utilizing a Bundled Authentication Key (BAK) generated by using an Extended Master Session Key (EMSK) that is an encryption key generated during access authentication.
Public/Granted literature
- US20100135487A1 BUNDLE AUTHENTICATION SYSTEM AND METHOD Public/Granted day:2010-06-03
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